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Lam Announces New Atomic Layer Deposition Platform Featuring ICEFill™ Technology

In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio (HAR) structures resulting in void-free, high quality, atomic layer deposition (ALD) films.

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Fueling Next-Generation Semiconductors at SEMICON Taiwan

Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall …

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Small, To Big, To Better

Diagnosis of any kind requires the synthesis of information. As humans we are much better at doing this when we have ways of visualizing information …

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Connect at SEMICON Southeast Asia

SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights …

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Lam Shapes Industry Agenda at SEMICON West

Lam CEO Tim Archer recently presented a compelling vision of the future at SEMICON West along with key industry leaders and influencers. Tim spoke of …

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Lam at Virtual SEMICON West

The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes, exhibits, and networking …

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Connect at SEMICON China 2020

A key semiconductor trade show and forum, SEMICON China, was held June 27–29 at the Shanghai New International Expo Centre. Lam was pleased to be …

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Lam at ALD/ALE 2020 Virtual Meeting

The 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will take place Monday, June …

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One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips

Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes …

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Copper Electrodeposition for Fan-Out Wafer-Level Packaging

As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective …

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Inside the Mysterious World of Plasma: A Process Engineer’s Perspective

Have you ever seen a lightning bolt? What about the northern lights or a neon sign? These things are made of plasma, the fourth state …

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CTO Perspective on a Data Driven World

Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference …

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Lam Revolutionizes Chipmaking Process with New Plasma Etching System

Building on four decades of etch industry leadership, Lam today launched a new plasma etch technology and system solution. The new Sense.i™ platform features Lam’s …

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Lam Introduces EUV Lithography Technology Breakthrough

Addressing critical needs for next-generation device scaling, Lam today introduced a new dry photoresist technology that offers significant improvement in EUV lithography resolution, productivity and …

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Patterning Symposium: Connecting Minds, Advancing Light

The full spectrum of patterning topics will be discussed at the upcoming SPIE Advanced Lithography symposium. Held at the San Jose Convention Center on February …

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Smarter Future on Stage at SEMICON Korea

[Notice]  SEMICON KOREA 2020 Is Canceled SEMICON Korea 2020, which was scheduled to be held from Feb 5 to Feb 7 by SEMI KOREA, will …

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2019 Blog Review: Top Posts of the Year

2019 was quite a year for the Lam Blog. From sharing an inside peek at our favorite day of the year, Bring Our Children to …

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Leveraging 300 mm Technologies at 200 mm for IoT and Automotive

The IoT and automotive markets use devices fabricated at a wide range of technology nodes. Taking advances made at 300 mm and applying them via …

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Lam Extends Leadership in Edge Control Solutions

Addressing the critical need for higher wafer edge yield, Lam has introduced new capabilities in its Corvus® etch and Coronus® plasma bevel clean systems.

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Making the Impossible Possible Through Cross-Institutional Collaboration

It is an exciting time to be in the semiconductor industry and driving technology development which is fueling the intelligent, interconnected systems that will transform …

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