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Lam’s University Engagements: Innovation Through Collaboration

Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards, scholarships, and fellowships. Through these collaborations, we accelerate innovation, gain access to specialized facilities, partner with top experts around the world, and give those in academia insight into industry challenges. In addition, ongoing relationships with professors and students fuel the industry’s talent pipeline.

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Advanced Patterning on Stage at SPIE Symposium

The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps …

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Revolutionizing Memory Manufacturing with Vantex™

With more than a decade of industry leadership in high aspect ratio etching, Lam now introduces Vantex™, the latest in dielectric etch technology. Designed from the ground …

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Accelerating Innovation at SEMICON Korea

To kick-off the new year, SEMICON Korea is bringing together industry leaders throughout the semiconductor supply chain.  Held February 3-12, participants can learn more about artificial intelligence, MEMS and sensors, and …

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Our Favorite Articles from 2020

To kick-off the new year, we thought we’d share some of our favorite stories from 2020. While not exhaustive, this short list features articles that …

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ALD Technology Fills Taller Memory

Filling complex, high aspect ratio structures is a challenge for 3D NAND, DRAM, and logic chipmakers. Lam’s Aaron Fellis, vice president and general manager of …

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FinFETs Give Way to Gate-All-Around

When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in …

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Winning the Global Race for Semiconductor Technology with Virtual Process Modeling

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming …

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Lam Introduces New Photoresist Strip Capability for 200 mm

Lam’s newest product in its line of GAMMA® dry photoresist strip systems, brings the performance of the GAMMA® GxT® 300 mm to 200 mm wafer …

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Silicon Snack: Software Update – Installing Smart Tech in Cities

Cities around the globe are experiencing software updates – swapping out antiquated data collection techniques for new technological initiatives to promote efficiency, transparency, and sustainability. …

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Lam Announces New Atomic Layer Deposition Platform Featuring ICEFill™ Technology

In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio …

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Fueling Next-Generation Semiconductors at SEMICON Taiwan

Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall …

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Small, To Big, To Better

Diagnosis of any kind requires the synthesis of information. As humans we are much better at doing this when we have ways of visualizing information …

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Connect at SEMICON Southeast Asia

SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights …

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Lam Shapes Industry Agenda at SEMICON West

Lam CEO Tim Archer recently presented a compelling vision of the future at SEMICON West along with key industry leaders and influencers. Tim spoke of …

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Lam at Virtual SEMICON West

The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes, exhibits, and networking …

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Connect at SEMICON China 2020

A key semiconductor trade show and forum, SEMICON China, was held June 27–29 at the Shanghai New International Expo Centre. Lam was pleased to be …

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Lam at ALD/ALE 2020 Virtual Meeting

The 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will take place Monday, June …

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One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips

Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes …

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Copper Electrodeposition for Fan-Out Wafer-Level Packaging

As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective …

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