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Dreams Start at SEMICON Japan

As a premier exposition for the electronics manufacturing supply chain, SEMICON Japan will brighten up Tokyo this December with the theme “dreams start here.” The …

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SEMICON Europa to Share Stage with Productronica in Munich

For the first time, SEMICON Europa will be co-located with productronica – one of the world’s leading trade fairs for electronics development and production – …

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Atomic-Scale Processing Heats Up Tampa at the AVS Symposium

Some of the greatest minds in science and technology will be convening in Tampa for the 64th annual AVS International Symposium & Exhibition starting on …

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Tech Brief: An Introduction to Interconnects

We often hear that advanced chips contain billions of transistors – an incredible, mind-blowing fact to be sure – but did you know that large-scale …

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Fall ECS Meeting Committed to #FreeTheScience

Scientists, engineers, researchers, and industry professionals from around the globe will descend upon National Harbor, Maryland, this October to interact at the 232nd Electrochemical Society …

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Resolving Process Variation Challenges in Multiple Patterning

Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process …

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Market Momentum and Opportunities Connect at SEMICON Taiwan

The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected …

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Rising Need for Vertical Scaling in a Data-Driven World

“Data is giving rise to a new economy” – The Economist (2017). This compelling reality makes the continued development of high-capacity data storage technologies like …

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New Corvus Technology Takes Uniformity Control to the Edge

Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this …

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Overcoming Challenges in 3D NAND Volume Manufacturing

The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per …

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ALD/ALE 2017 to Showcase Advances in Atomic-Scale Processing

The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications …

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SEMICON West Aims to Shake Things Up in San Francisco

If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West …

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Enabling Advanced ICs with Multiple Patterning

Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly …

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Tech Brief: A Look at Atomic Layer Deposition (ALD)

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …

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SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important …

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Technology and Economic Considerations for Panel-Level Fan-Out Packaging

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …

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Gearing Up for SEMICON China 2017

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking …

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Focus on Next-Gen Chipmaking at SPIE Advanced Lithography Symposium

It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits …

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SEMICON Korea to Explore Latest Technology Advances

For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, …

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Tech Brief: Primer on Packaging

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. …

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