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FinFETs Give Way to Gate-All-Around

When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in …

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Winning the Global Race for Semiconductor Technology with Virtual Process Modeling

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming …

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Lam Introduces New Photoresist Strip Capability for 200 mm

Lam’s newest product in its line of GAMMA® dry photoresist strip systems, brings the performance of the GAMMA® GxT® 300 mm to 200 mm wafer …

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Silicon Snack: Software Update – Installing Smart Tech in Cities

Cities around the globe are experiencing software updates – swapping out antiquated data collection techniques for new technological initiatives to promote efficiency, transparency, and sustainability. …

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Lam Announces New Atomic Layer Deposition Platform Featuring ICEFill™ Technology

In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio …

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Fueling Next-Generation Semiconductors at SEMICON Taiwan

Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall …

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Small, To Big, To Better

Diagnosis of any kind requires the synthesis of information. As humans we are much better at doing this when we have ways of visualizing information …

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Connect at SEMICON Southeast Asia

SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights …

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Lam Shapes Industry Agenda at SEMICON West

Lam CEO Tim Archer recently presented a compelling vision of the future at SEMICON West along with key industry leaders and influencers. Tim spoke of …

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Lam at Virtual SEMICON West

The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes, exhibits, and networking …

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Connect at SEMICON China 2020

A key semiconductor trade show and forum, SEMICON China, was held June 27–29 at the Shanghai New International Expo Centre. Lam was pleased to be …

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Lam at ALD/ALE 2020 Virtual Meeting

The 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will take place Monday, June …

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One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips

Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes …

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Copper Electrodeposition for Fan-Out Wafer-Level Packaging

As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective …

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Inside the Mysterious World of Plasma: A Process Engineer’s Perspective

Have you ever seen a lightning bolt? What about the northern lights or a neon sign? These things are made of plasma, the fourth state …

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CTO Perspective on a Data Driven World

Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference …

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Lam Revolutionizes Chipmaking Process with New Plasma Etching System

Building on four decades of etch industry leadership, Lam today launched a new plasma etch technology and system solution. The new Sense.i™ platform features Lam’s …

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Lam Introduces EUV Lithography Technology Breakthrough

Addressing critical needs for next-generation device scaling, Lam today introduced a new dry photoresist technology that offers significant improvement in EUV lithography resolution, productivity and …

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Patterning Symposium: Connecting Minds, Advancing Light

The full spectrum of patterning topics will be discussed at the upcoming SPIE Advanced Lithography symposium. Held at the San Jose Convention Center on February …

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Smarter Future on Stage at SEMICON Korea

[Notice]  SEMICON KOREA 2020 Is Canceled SEMICON Korea 2020, which was scheduled to be held from Feb 5 to Feb 7 by SEMI KOREA, will …

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