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Changes in DRAM

The ability to process data is foundational to our smart, connected world. Microprocessors, in turn, rely on memory chips to store the data they need while working. One of the most popular types of memory is dynamic random access memory (DRAM), and it can be found in many of our favorite electronic devices. Over the years, the amount of memory in mobile phones has increased from 128 MB to 4 GB or even 6 GB today.

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Lam ships its 10,000th single wafer clean chamber

Lam recently achieved an impressive product milestone with the shipment of our 10,000th single wafer clean chamber. This marks an incredible journey from the SP100 single chamber …

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Unlocking innovation through university research collaborations

We play a critical role in driving semiconductor breakthroughs for the next generation. Since 2015, Unlock Ideas has been an integral program to unleash the …

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SEMICON Southeast Asia – Powering Innovation

From August 23-27, our experts will join industry leaders at SEMICON Southeast Asia, to discuss semiconductor advancements in an era of 5G and next-generation technologies. …

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Specialty Technologies – Changing Our Lives One Chip at a Time

As a materials engineer, I am very proud of the fact that key advances in human civilization have been driven by materials innovation. The stone …

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What Is the Internet of Things?

There’s a lot of talk about the Internet of Things (IoT) and its impact on our day-to-day lives. From home security systems to smart watches, …

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Using Less Helium Is Good Business

Helium gas is increasingly in short supply. While consumers may be most familiar with it for use in filling balloons, it is used much more heavily in a variety of industrial processes – including semiconductor fabrication. As …

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Happy 40th Anniversary, AutoEtch

Back in 1981, Lam pioneered single-wafer plasma etch tools with its first product, the Lam AutoEtch 480 plasma etcher. Introduced as “a streamlined plasma etching system designed specifically for highly automated …

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Connect with Lam at IITC

The IEEE International Interconnect Technology Conference (IITC) will be held July 6-9, 2021, as a hybrid event – virtual and in-person (Kyoto Research Park, Kyoto, …

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Chipmakers Achieve Higher Equipment Availability with Lam’s WCO

Preventative Maintenance “What is wet, but dry?” might sound like a riddle, and the answer for plasma process tools are “wet cleans,” an important type of preventative maintenance. The term “wet clean” comes from …

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ALD/ALE 2021 to Showcase Atomic-Scale Processing

Chip features continue to shrink to incredibly small dimensions and different device architectures are being devised to supply consumers with more powerful electronics. Atomic layer deposition (ALD) and atomic …

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The Four Pillars of Lam Equipment Intelligence®

The pervasive use of technology has brought about a tremendous growth in data as well as an explosion in scaling and complexity of integrated circuits. …

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Happy Golden Anniversary to the Microprocessor

We take microprocessors for granted. Most people who aren’t deeply involved in technology may have no idea all of the places where a microprocessor shows …

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Lam Participation at ECS Spring Meeting

Engineers, scientists, and industry professionals will attend the 239th Electrochemistry Society (ECS) Meeting and the 18th International Meeting on Chemical Sensors (IMCS), held May 30 to June …

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Lam Silicon Parts Drive Memory Success

Silicon chip manufacturing has always included etching as a critical processing step. But, increasingly, extremely high-aspect-ratio etching has been needed for 3D flash and DRAM chips, …

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Why New Photoresist Technology Is Critical

As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to…

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Lam’s University Engagements: Innovation Through Collaboration

Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards…

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Advanced Patterning on Stage at SPIE Symposium

The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps…

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Revolutionizing Memory Manufacturing with Vantex™

With more than a decade of industry leadership in high aspect ratio etching, Lam now introduces Vantex™, the latest in dielectric etch technology. Designed from the ground …

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Accelerating Innovation at SEMICON Korea

To kick-off the new year, SEMICON Korea is bringing together industry leaders throughout the semiconductor supply chain.  Held February 3-12, participants can learn more about artificial intelligence, MEMS…

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