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Lam at Virtual SEMICON West

The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes, exhibits, and networking opportunities. The live programs and exhibits will run July 20–23, with on-demand access through September 20.

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Connect at SEMICON China 2020

A key semiconductor trade show and forum, SEMICON China, was held June 27–29 at the Shanghai New International Expo Centre. Lam was pleased to be …

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Lam at ALD/ALE 2020 Virtual Meeting

The 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will take place Monday, June …

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One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips

Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes …

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Copper Electrodeposition for Fan-Out Wafer-Level Packaging

By Steven T. Mayer, Bryan Buckalew, and Kari Thorkelsson As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D …

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Inside the Mysterious World of Plasma: A Process Engineer’s Perspective

Have you ever seen a lightning bolt? What about the northern lights or a neon sign? These things are made of plasma, the fourth state …

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CTO Perspective on a Data Driven World

Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference …

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Lam Revolutionizes Chipmaking Process with New Plasma Etching System

Building on four decades of etch industry leadership, Lam today launched a new plasma etch technology and system solution. The new Sense.i™ platform features Lam’s …

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Lam Introduces EUV Lithography Technology Breakthrough

Addressing critical needs for next-generation device scaling, Lam today introduced a new dry photoresist technology that offers significant improvement in EUV lithography resolution, productivity and …

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Patterning Symposium: Connecting Minds, Advancing Light

The full spectrum of patterning topics will be discussed at the upcoming SPIE Advanced Lithography symposium. Held at the San Jose Convention Center on February …

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Smarter Future on Stage at SEMICON Korea

[Notice]  SEMICON KOREA 2020 Is Canceled SEMICON Korea 2020, which was scheduled to be held from Feb 5 to Feb 7 by SEMI KOREA, will …

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2019 Blog Review: Top Posts of the Year

2019 was quite a year for the Lam Blog. From sharing an inside peek at our favorite day of the year, Bring Our Children to …

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Leveraging 300 mm Technologies at 200 mm for IoT and Automotive

The IoT and automotive markets use devices fabricated at a wide range of technology nodes. Taking advances made at 300 mm and applying them via …

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Lam Extends Leadership in Edge Control Solutions

Addressing the critical need for higher wafer edge yield, Lam has introduced new capabilities in its Corvus® etch and Coronus® plasma bevel clean systems.

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Making the Impossible Possible Through Cross-Institutional Collaboration

It is an exciting time to be in the semiconductor industry and driving technology development which is fueling the intelligent, interconnected systems that will transform …

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Nanoscale Features through Atomic Scale Processing

Atomic layer etching and deposition processes offer atomic scale control through the use of self-limiting reactions. Yang Pan, corporate vice president of advanced technology development, …

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SEMICON Europa Drives Smart Transportation and More

The SEMICON Europa tradeshow, the annual premier event for the global electronics industry in Europe, will take place November 12-15, 2019, at Messe München in …

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Working in More-than-Moore

Moore’s Law has been the center of the semiconductor universe, dominated by a singular focus and a relentless drive to reduce transistor size and integrate …

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Advanced Packaging Innovations Star at ASTC

Technology experts and business leaders will be heading to the Advanced Semiconductor Technology Conference (ASTC) 2019, organized by SEMI Southeast Asia. Held November 7-8, 2019 …

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Atomic-Scale Processing and More at AVS Symposium

The science and technology of materials, interfaces, and processing will be in the spotlight at the AVS 66th International Symposium and Exhibition, being held October …

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