![SEMICON Europa logo](/image/SEMICON_Europa_2017sq_10.30.17.jpg)
For the first time, SEMICON Europa will be co-located with productronica – one of the world’s leading trade fairs for electronics development and production – at Messe München in Munich, Germany. Both events open on November 14, 2017. The co-location creates the strongest single event for electronics manufacturing in Europe and broadens the range of attendees across the electronics supply chain. SEMICON Europa programs will feature key market segments in Europe such as micro-electromechanical systems (MEMS) and sensors, power and flexible electronics, and the Internet of Things (IoT), providing valuable updates and information supporting the semiconductor industry.
Technical Conferences and Forums
Several parallel technical programs will address topics including advanced packaging, power electronics, materials, and more. Lam is pleased to be a sponsor of the 21st Fab Management Forum, where the opening session on “New Quality Methods – Key Drivers for Operational Excellence” will focus on the continuous improvement of product quality. For the manufacture of many IoT devices, previous-generation 200 mm processing equipment can be a cost-efficient solution, provided key manufacturing cost areas are optimized. With this in mind, Lam’s David Haynes will discuss “Meeting the Increased Demand for 200 mm Capacity by Enhancing Capital Efficiency and Fab Productivity for IoT Applications” in this session on Tuesday, November 14 at 3:05 PM.
TechARENAs
SEMICON Europa features two Technology Arenas with more than 60 presentations on the latest technologies, products, and innovations. In TechARENA 2, a session on Secondary Equipment will address extending the use of older chipmaking equipment for cost-efficient manufacturing of the relatively lower-priced devices that enable key market sectors such as mobility and health, as well as applications for industrial productivity. Looking forward to newer devices that are needed for these markets, Lam’s Evan Patton will discuss “Leveraging 300 mm Technology Solutions to Enable New Process Capabilities for MEMS” in this session on Wednesday, November 15 at 12:40 PM.
Connect with Lam
While at the show, be sure to stop by our booth on the exhibitor floor located at B1.1220. Lam experts will be on hand to discuss a range of solutions for your technology and productivity needs.
For more information about the show, including complete schedules and registration details, please visit the SEMICON Europa website.