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Welcome to the Lam Research Newsroom
Blog Article: One-on-One with Lam CTO Rick Gottscho – Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips
Blog Article: Copper Electrodeposition for Fan-Out Wafer-Level Packaging
Blog Article: Silicon Snack – eSports Are Taking the Field
Blog Article: Inside the Mysterious World of Plasma: A Process Engineer’s Perspective

Latest News

Lam Research Corporation Announces Participation at Upcoming Conference

May 27, 2020
Press Release

Lam Research Corporation Announces Participation at Upcoming Conference

May 19, 2020
Press Release

Lam Research Corporation Declares Quarterly Dividend

May 15, 2020
Press Release

Lam Research Corporation Reports Financial Results for the Quarter Ended March 29, 2020

April 22, 2020
Press Release

Latest Blogs

One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips

May 28, 2020

Industry, Technology

Copper Electrodeposition for Fan-Out Wafer-Level Packaging

May 11, 2020

Technology

Silicon Snack: eSports Are Taking the Field

May 4, 2020

Industry

Inside the Mysterious World of Plasma: A Process Engineer’s Perspective

April 27, 2020

Industry

More Blog articles »