The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected to attract more than 45,000 visitors from around the world. From September 13-15, the Taipei Nangang Exhibition Center will host attendees from the global electronics manufacturing supply chain with a focus on market momentum and opportunities.
Once again, Lam is proud to sponsor the Gala Dinner, honoring business leaders in the global semiconductor industry. This invitation-only event is a rare opportunity to socialize with executives and key-decision makers. We’re also sponsoring the Advanced Packaging Technology Symposium on Wednesday and the SiP Global Summit and IC Forum on Friday. Lam experts will be on hand to present at each of these sessions, as well as at the Smart Manufacturing Forum. Details of our participation throughout SEMICON Taiwan are shown below.
Delivering Innovative Technology & Trusted Productivity Solutions for Advanced Packaging
CheePing Lee
Advanced Packaging Technology Symposium
Wednesday, September 13, 11:00 AM
Equipment Intelligence Enabling Productivity and Performance
Jason Shields
Smart Manufacturing Forum
Wednesday, September 13, 2:20 PM
High-Volume Manufacturing Introduction of Dielectric Atomic Layer Etching
Barrett Finch
IC Forum
Friday, September 15, 10:35 AM
Advanced Packaging Inflection – Technology Trends and Growth Opportunities
Manish Ranjan
SiP Global Summit 2017 – Embedded and Fan Out Package Technology Forum
Friday, September 15, 11:50 AM
For more details about the show, including complete schedules and registration information, please visit the SEMICON Taiwan website.
