Consumer demand for smaller, faster, and more powerful mobile electronics is driving innovations in semiconductor chip packaging, the tiny external connections for device input/output. The development of alternative packaging approaches, such as chip-level and wafer-level packaging (WLP), is generating new manufacturing challenges.
The chip packaging community will gather in China to discuss these challenges at the 15th International Conference on Electronic Packaging Technology (ICEPT 2014) from August 12-15 in Chengdu. This event includes technical sessions, professional development courses, and an exhibition. Technical sessions will explore topics such as recent developments in packaging materials and processes, high-density interconnection technologies, advanced packaging strategies including through-silicon vias (TSVs), and emerging technologies.
We are pleased to be a sponsor of this annual international conference. Lam will present a keynote titled “Electrochemical Deposition in the 3D World”. In this presentation, we will leverage our extensive experience as the market leader in copper electrochemical deposition to share our perspectives on key challenges facing the emerging 3D packaging deposition processes. Lam will also give an invited talk titled, “Novel Process Integration for Fabricating Small Size TSVs with High Aspect Ratios,” which will focus on TSV for 2.5D/3D integration.
For more information about this conference, please visit the ICEPT website.