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Lam to Discuss Advances in Atomic-Scale Processing at Fall ECS

September 29, 2014 | Technology

Experts from Lam’s deposition and etch product groups have been invited to speak on atomic-scale processing at the 2014 Electrochemical Society (ECS) and Sociedad Mexicana de Electroquimica (SMEQ) Joint International Meeting being held October 5-10, 2014, in Cancun, Mexico. Additionally, Lam is a Gold Sponsor of this conference, which provides a forum for sharing recent advances in electrochemistry and solid-state science and technology.

As features sizes continue to shrink and new device architectures are introduced, the industry is shifting toward manufacturing chips at the atomic scale. Atomic layer deposition (ALD) and atomic layer etch (ALE) use cycles of multi-step processes that deposit or remove a few atomic layers at a time, thereby delivering the precise control needed to create the most advanced structures.

Scaling of next-generation logic and memory semiconductor devices requires depositing highly conformal thin films, often on complex topographies and, ideally, at relatively low processing temperatures. ALD is currently being used in low-temperature, high-volume manufacturing to deposit high-k dielectric materials, as well as high-conformality silicon oxide films. In his talk, “Challenges with Industrialization of Atomic Layer Deposition of Silicon Nitride” (Tuesday, October 7, 10 a.m.), Lam’s Dr. Dennis Hausmann will discuss the issues associated with developing ALD of silicon nitride for an ever-growing list of applications.

A process parallel to ALD, ALE has the additional requirement of etching directionally to remove material in high aspect ratio (deep and narrow) features. ALE has only recently joined its deposition counterpart as a production-worthy capability, as announced earlier this year. Dr. Thorsten Lill from Lam will present the framework of high-productivity ALE processing and illustrate the implications for hardware and process development in his presentation, “Plasma Etch in the Era of Atomic Scale Fidelity” (Tuesday, October 7, 2 p.m.).


To learn more about how ALD and ALE processes work, please see our video: Lam Research – Engineering at the Atomic Scale.

For conference details, please visit the ECS website.



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