Building on four decades of etch industry leadership, Lam today launched a new plasma etch technology and system solution. The new Sense.i™ platform features Lam’s Equipment Intelligence® technology and capabilities for increased productivity, all in new architecture designed to save valuable space in a customer’s fab. As Lam celebrates 40 years of semiconductor equipment manufacturing, the company continues to define the past, present, and future of wafer processing equipment.
FREMONT, Calif., March 03, 2020 (GLOBE NEWSWIRE) — Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a completely transformed plasma etch technology and system solution, designed to provide chipmakers with advanced functionality and extendibility required for future innovation. Lam’s groundbreaking Sense.i™ platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity, supporting logic and memory device roadmaps through the coming decade.
With core technology evolved from Lam’s industry-leading Kiyo® and Flex® process modules, the Sense.i platform enables the critical etch capabilities required to continue advancing uniformity and etch profile control for maximizing yield and lowering wafer costs. As dimensions shrink and aspect ratios increase, the Sense.i platform is designed to support future technology inflections.
Powered by Lam’s Equipment Intelligence® technology, the self-aware Sense.i platform enables semiconductor manufacturers to capture and analyze data, identify patterns and trends, and specify actions for improvement. Sense.i also features autonomous calibration and maintenance capabilities that reduce downtime and labor costs, and delivers machine learning algorithms that allow the tool to self-adapt to minimize process variations and maximize wafer output.
The Sense.i platform has a revolutionary space-saving architecture that will help customers meet their future wafer output targets by producing more than a 50% improvement in etch output density. As semiconductor manufacturers develop smarter, faster, and denser chips, processes are rapidly growing in complexity and number of steps. This requires a greater number of process chambers in a fab and reduces total output for a given floor space. The Sense.i platform’s smaller footprint benefits either a new fab build or a fab undergoing a node-to-node technology conversion.
“Lam is introducing the most innovative etch product that has been developed in the last 20 years,” said Vahid Vahedi, senior vice president and general manager of the Etch product group at Lam Research. “Sense.i extends our technology roadmap to meet our customers’ next-generation requirements while solving the critical cost scaling challenges they’re facing in their business. With more than four million wafers processed on Lam etch systems every month, Lam has an installed-base that provides extraordinary learning to innovate, design, and produce the best tools for semiconductor manufacturing.”