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Lam Participation at ECS Spring Meeting

May 24, 2021

Engineers, scientists, and industry professionals will attend the 239th Electrochemistry Society (ECS) Meeting and the 18th International Meeting on Chemical Sensors (IMCS), held May 30 to June 3. Highlighting recent innovations in the areas of electrochemistry and solid state science and technology, this digital event is the premier destination for industry professionals to experience five days of learning, technical presentations, business development, and networking opportunities. 

Lam experts will be sharing advances in materials for advanced interconnects, atomic scale processing, and process solutions for phase change memory devices. Lam is proud to be a silver sponsor of the Plasma and Thermal Processes for Materials Modification, Synthesis, and Processing (D02symposium, and we will be participating in the following presentations: 

Alternative Metals for Advanced Interconnects: Cobalt and Beyond
M. A. Rigsby, T. A. Spurlin, and J. D. Reid (Lam Research Corporation)
Symposium E02Electrodeposition as Enabler of (other) Electrochemical Processes and Devices
Tuesday, June 1, 2021 7:00-7:20 and 9:35 to 9:45 

Isotropic Atomic Layer Etching in High Aspect Ratio Structures
A. Fischer, P. Lemaire, A. Routzahn, and T. Lill (Lam Research Corporation)
Symposium D02: Plasma and Thermal Processes for Materials Modification, Synthesis, and Processing
Wednesday, June 2, 2021 14:20-14:40 

Holistic Integrated Process Solutions for Patterning Phase Change Memory Devices
J. Hoang, M. Shen, T. Lill, D. Qian, A. Routzahn, J. Chen, N. Altieri, A. Yu, A. Dulkin, J. Sims, A. McKerrow, and R. Dylewicz (Lam Research Corporation)
Symposium D02: Plasma and Thermal Processes for Materials Modification, Synthesis, and Processing Wednesday, June 2, 2021 14:40-15:00

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