Addressing the critical need for higher wafer edge yield, Lam has introduced new capabilities in its Corvus® etch and Coronus® plasma bevel clean systems.
Chipmakers have long sought to overcome manufacturing process variability, which is particularly challenging at the edge of the wafer – commonly defined as the outermost ring (~ 10 mm wide). During plasma etch, the physical edge of the wafer creates electrical and chemical discontinuities that affect the process and cause unwanted non-uniformity. As devices scale and architectures become more complex, variability tolerance for a particular processing step is now sub-nanometer.
Another edge challenge is maintaining cleanliness of the bevel – the rounded or slanted area at the very edge of the wafer. If not removed, polymers, particles, and unwanted films from this region can migrate to the device area of the wafer and affect yield.
As described in the announcement below, Lam extends its leadership in edge control solutions for high volume manufacturing, enabling uniform, repeatable performance, and lower cost of ownership. Lam continues to be the go-to solution provider for increased edge yield in high volume manufacturing. Lam is able to combine the benefits of Corvus technology with the production-proven Coronus plasma bevel clean for a total edge yield solution.
Lam Research Offers New Capabilities in Its Edge Yield Product Portfolio
FREMONT, Calif., Dec. 03, 2019 (GLOBE NEWSWIRE) — Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer, which is essential to delivering greater productivity for customers.
During the semiconductor production process, device manufacturers want to build integrated circuits on the entire surface of the wafer. On the edge of the wafer, where chemical, physical and thermal discontinuities are harder to control, the risk of yield loss increases. Controlling etch non-uniformity and preventing defects at the wafer’s edge is key to semiconductor device manufacturing cost reduction.
Lam offers edge yield solutions for high volume manufacturing with the Corvus® etch and Coronus® plasma bevel clean systems. These solutions can be found in leading-edge node manufacturing facilities around the world and are extensively used by advanced foundry, logic, DRAM, and NAND customers.
Corvus enhances edge yield on the Kiyo® and Versys® Metal systems by smoothing out extreme edge discontinuities. With Corvus, every die on the wafer sees the same conditions for optimal yield, reducing previously seen systematic die-to-die variability. Lam’s Corvus technology also minimizes deviation at the edge using its tunability features.
Coronus improves device yield by removing defect sources from the bevel region or depositing encapsulating layers for bevel protection. Coronus’ versatility manages bevel challenges such as eliminating defects from film/polymer residues and roughened surfaces, as well as depositing layers for bevel protection during long otherwise damaging etch processes. The Coronus product family demonstrates excellent repeatability enabled by proprietary wafer placement and plasma confinement technologies.
“Substantially increasing yield at the edge of a wafer is a significant factor in terms of reducing costs at advanced nodes,” said Vahid Vahedi, senior vice president and general manager of the Etch product group at Lam Research. “Lam collaborates with customers very early in the development process, which allows us to identify and solve the unique technical challenges they face at the edge of the wafer. Lam has extended our capabilities for improved productivity and greater yield that is critical for cost-effective device scaling.”