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Journal Papers Showcase Research at Lam
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Jan 11, 2016
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From materials research to plasma fundamentals, Lam’s technologists are contributing to practical and theoretical developments in their fields. One way they help advance technology and expand scientific knowledge is by publishing in peer-reviewed journals, often in collaboration with academic researchers. See below for some of our recent publications from the technical literature.

 

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Leakage Current Mechanisms and Their Dependence on Composition in Silicon Carbonitride Thin Films
Vishnuvardhanan Vijayakumar and Bhadri Varadarajan, Lam Research Corp.
Mater. Res. Express 2 (2015) 046302

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Work Function Tuning of Plasma-Enhanced Atomic Layer Deposited WCxNy Electrodes for Metal/Oxide/Semiconductor Devices
Oren Zonensain (1), Sivan Fadida (1), Ilanit Fisher (2), Juwen Gao (2), Kaushik Chattopadhyay (2), Greg Harm (2), Tom Mountsier (2), Michal Danek (2), Moshe Eizenberg (1)
1-Technion—Israel Institute of Technology, 2-Lam Research Corp.
Appl. Phys. Lett. 106, 082107 (2015)

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Ultrathin Graphene and Graphene Oxide Layers as a Diffusion Barrier for Advanced Cu Metallization
Jae Hoon Bong (1), Seong Jun Yoon (1), Alexander Yoon (2), Wan Sik Hwang (3), Byung Jin Cho (1)
1-KAIST, 2-Lam Research Corp., 3-Korea Aerospace Univ.
Appl. Phys. Lett. 106, 063112 (2015)

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Overview of Atomic Layer Etching in the Semiconductor Industry
Keren J. Kanarik, Thorsten Lill, Eric A. Hudson, Saravanapriyan Sriraman, Samantha Tan, Jeffrey Marks, Vahid Vahedi, Richard A. Gottscho, Lam Research Corp.
J. Vac. Sci. Technol. A, Vol. 33, 020802 (2015)

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Highly Selective Directional Atomic Layer Etching of Silicon
Samantha Tan, Wenbing Yang, Keren J. Kanarik, Thorsten Lill, Vahid Vahedi, Jeff Marks, Richard A. Gottscho, Lam Research Corp.
ECS J. Solid State Sci. Technol. Vol. 4, Issue 6, N5010-N5012 (2015)

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Control of Ion Energy and Angular Distributions in Dual-Frequency Capacitively Coupled Plasmas Through Power Ratios and Phase: Consequences on Etch Profiles
Yiting Zhang (1), Mark J. Kushner (1), Saravanapriyan Sriraman (2), Alexei Marakhtanov (2), John Holland (2), and Alex Paterson (2)
1-Univ. of Michigan, 2-Lam Research Corp.
J. Vac. Sci. Technol. A, Vol. 33, 031302 (2015)

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Dewetting Model Study on a Spinning Substrate – Challenges for Low Chemical Consumption
Ken-ichi Sano, David Mui, Mark Kawaguchi, Lam Research Corp.
ECS Trans. Vol. 69, Issue 8, 139-144 (2015)

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Using Deionized Water to Remove Polystyrene Latex Particles from Oxide Layer by Single-Wafer Spin Processing
Kei Kinoshita, Philipp Engesser, Harald Okorn-Schmidt, Lam Research Corp.
ECS J. Solid State Sci. Technol. Vol. 3, Issue 11, P357-P362 (2014)

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Improvement in Surface Grinding Damage in Silicon Wafers by Chemical Spin Etching
Kei Kinoshita, Lam Research Corp.
ECS J. Solid State Sci. Technol. Vol. 3, Issue 4, Q61-Q64 (2014)

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