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Innovation Abounds at SEMICON China 2018

March 5, 2018
Hui-Yun Chen |
Category:
Technology

As one of the semiconductor industry’s largest annual tradeshow, SEMICON China is a great place to connect, collaborate, and innovate with the region’s growing chipmaking business. Attendees from around the world will gather at the Shanghai New International Expo Centre on March 14-16, 2018, for the event. Many of the event activities will center on expanding the manufacturing infrastructure as China continues to grow as an important region for the semiconductor industry. With diverse digital economy demand continuing, additional manufacturing capacity is being added in China as fab projects come online to develop and increase the indigenous semiconductor supply chain, according to SEMI’s January 2018 Global Update.

SEMICON Events

Kicking off the show, the Grand Opening event will feature keynote talks on the state of the industry, major trends, and other timely topics. We are honored that Rick Gottscho, Lam’s corporate chief technology officer, will join other industry leaders who have been invited to share their perspectives at this important event. Lam experts will also be participating in several of the SEMICON China forums, as listed below. In addition, Lam is sponsoring the show’s Gala Dinner, the “China Memory Strategic” forum, and the “Build China’s IC Ecosystem” forum.

Grand Opening Keynote: “Enabling Atomic Scale Manufacturing”
Rick Gottscho
Grand Opening Keynote
Wednesday, March 14, 3:40 PM

Welcome Speech
Rick Gottscho
Build China’s IC Ecosystem Forum
Thursday, March 15, 9:00 AM

Addressing IoT Applications by Leveraging 300 mm Technology Solutions to Enable New Process Capabilities at 200 mm
David Haynes
Build China’s IC Ecosystem Forum
Thursday, March 15, 2:20 PM

Overcoming Manufacturing Challenges for Memory Technologies
Harmeet Singh
China Memory Strategic Forum
Friday, March 16, 1:55 PM

Technical Symposia

Attendees can also benefit from SEMICON China’s close association with the China Semiconductor Technology International Conference (CSTIC), being held in conjunction with the tradeshow on March 11-12. Exploring a wide range of manufacturing topics, CSTIC 2018 provides an excellent opportunity to learn about the industry’s latest advances in semiconductor technology. The conference will feature nine technical symposia organized around core areas such as thin films, lithography and patterning, as well as etch and clean. We are proud to be a Silver Sponsor of CSTIC, and several Lam experts will share new developments and results for enabling technologies.

(Invited) Patterning Roadmap
Rich Wise
Symposium II and Symposium III-Lithography/Etch joint session
Sunday, March 11, 1:35 PM

(Invited) Metal Interconnect Considerations for Logic 5 nm Node and Beyond
Steve Lai
Symposium IV: Thin Film, Plating and Process Integration
Sunday, March 11, 4:20 PM

De-wetting Model Study on Spinning Substrate – Challenges for Low Chemical Consumption
Christian Haigermoser
Symposium II and Symposium III-Lithography/Etch joint session
Sunday, March 11, poster session

Coping the Depth Loading in High Aspect Ratio Etching
Stephen Liou
Symposium II and Symposium III-Lithography/Etch joint session
Sunday, March 11, poster session

Dry Strip Assisted Reduction of High Aspect Ratio Silicon Feature Bending Post-Wet Clean
Dongyang Yu
Symposium II and Symposium III-Lithography/Etch joint session
Sunday, March 11, poster session

Application of CF4 Chemistry for Removing TiN/High-k Footing Residual
Yiling Sun
Symposium II and Symposium III-Lithography/Etch joint session
Sunday, March 11, poster session

Chamber Wall Surface Properties Induced Change of Etching Performance
Tongxun Guo
Symposium II and Symposium III-Lithography/Etch joint session
Sunday, March 11, poster session

Application of Plasma Pulsing in a Metal Gate Etch Back Process
Tianyin Sun
Symposium II and Symposium III-Lithography/Etch joint session
Sunday, March 11, poster session

(Invited) Machine Learning Enabled In Situ Etch Endpoint Control
Ye Feng
Symposium VI: Metrology, Reliability and Testing
Monday, March 12, 10:30 AM

(Invited) Electrochemical ALD – A New Paradigm for Enabling Aggressive Scaling in BEOL Interconnect Metallization
Yezdi Dordi
Symposium IV: Thin Film, Plating and Process Integration
Monday, March 12, 11:05 AM

(Invited) Memory Patterning Roadmaps
Siva Kanakasabapathy
Symposium II and Symposium III-Lithography/Etch joint session
Monday, March 12, 1:30 PM

Complete schedules and registration information can be found on the SEMICON China website. We look forward to meeting with you at the show.

 

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