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Fueling Next-Generation Semiconductors at SEMICON Taiwan

September 8, 2020

Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), participants can learn more about next-generation semiconductors, industry drivers, and emerging technologies.

Lam is proud to be a platinum sponsor of SEMICON Taiwan, as well as the sponsor of the Leadership Gala Dinner on Wednesday, September 23. Following is a summary of Lam’s participation throughout the conference:

Unprecedented Challenges Require Disruptive Solutions
Master Forum
Tim Archer
Wednesday, September 23, 4:00 PM

Enabling Next Generation Heterogenous Integration Challenges with Wet Equipment and Technology
SiP Global Summit – Day 1
Thomas Ponnuswamy
Tuesday, September 22, 11:50 AM

Bridging the Gap Between 200mm and 300mm MEMS and Sensor Production
MEMS & Sensors Forum
David Haynes
Tuesday, September 22, 2:15 PM

The Era of Equipment Intelligence®
Smart Manufacturing Forum
Jason Shields
Wednesday, September 23, 10:00 AM

3D Process-Monitor Using Advanced Mass Metrology
Semiconductor Advanced Inspection and Metrology Forum
Jiangtao Hu
Friday, September 25, 3:00 PM

Full Stack Computational Optimization Through Virtual Fabrication
IC Forum
Joseph Ervin
Friday, September 25, 3:25 PM

Complete schedules and registration information can be found on the SEMICON Taiwan website.

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