The 22nd Electronics Packaging Technology Conference (EPTC) is going virtual this year. The flagship event of the IEEE Electronics Packaging Society (EPS) in Region 10 will highlight technical developments in all areas of electronic packaging from design to manufacturing and operation. It also provides opportunities to network and meet with leading international experts. The live programs will run December 2-3, with on-demand access through December 29.
Lam is pleased to support research and industry leaders through our platinum sponsorship. In addition, Lam’s Manish Ranjan, a managing director in the Deposition Product Group, will be giving a keynote supporting this year’s conference theme of “Advanced Packaging for Heterogeneous Integration.” His talk will cover the industry drivers for new packaging solutions, then discuss some of the solution options and their equipment and process challenges.
Keynote: Enabling the New Era of Heterogenous Integration Solutions
Wednesday, December 2, 9:00
Complete schedules and registration information can be found on the EPTC website.