The Electronics Packaging Technology Conference (EPTC 2018), an international event organized by the IEEE Reliability/CPMT/ED Singapore Chapter, will be held December 4–7 at the Resorts World Sentosa Convention Centre in Singapore. This year, celebrating its 20th anniversary, the conference highlights technical developments in all areas of electronic packaging from design to manufacturing and operation. In addition to providing a major forum for the exchange of knowledge, it also provides opportunities to meet and network with leading experts in the field, as well as an exhibition, professional development courses, and other special programs.
Lam is pleased to be the platinum sponsor of this well-regarded technical conference and will also have a booth (#15 and #16) on the exhibition floor. Lam’s Chandra Bhesetti and Chee Ping Lee served on this year’s Equipment and Process Automation committee. We will be participating in several sessions during the event, and you can hear about some of Lam’s latest packaging solutions at the following presentations:
Increasing Strategic Relevance of Advanced Packaging for Next Generation Semiconductor Devices
Manish Ranjan
Wednesday, December 5, 1:30 PM
Enabling Industry Megatrends with Advanced Packaging Solutions
Chee Ping Lee
Thursday, December 6, 10:00 AM
Within Die Coplanarity Improvement Strategies for Electroplated Cu Pillars
Gabe Graham, Lee Peng Chua, Bryan Buckalew, Thomas Ponnuswamy, Steve Mayer
Friday, December 7, 2:20 PM
Complete schedules and registration information can be found on the EPTC website.
