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Connect with Lam at IITC

July 6, 2021

The IEEE International Interconnect Technology Conference (IITC) will be held July 6-9, 2021, as a hybrid event – virtual and in-person (Kyoto Research Park, Kyoto, Japan), with on-demand content available until August 20, 2021. 

Through our silver sponsorship, we are pleased to support this premier conference, which brings together experts from around the world to discuss interconnect and metallization design, material and unit processes, integration, and reliability. If you are attending, please stop by our virtual exhibition booth and the presentations with our collaborators, listed below. 

Process Integration of High Aspect Ratio Vias with a Comparison Between Co and Ru Metallizations  
Victor-Hugo Vega-Gonzalez1, Daniel Montero1, Janko Versluijs1, Olalla Varela Pedreira1, Nicolas Jourdan1, Harinarayanan Puliyalil1, Bilal Chehab1, Tobias Peissker2, Ali Haider2, Dmitry Batuk1, Gerardo Tadeo Martinez Alanis1, Jef Geyp1  
1imec, 2Lam Research
Thursday, July 8, 9:25-9:50 AM

Selective Deposition of AlOx for Fully Aligned Via in Nano Cu Interconnects  
Son Nguyen1, Hosadurga Shobha1, Corneliu Peethala1, Thomas Haigh1, Huai Huang1, Juntao Li1, James Demarest1, Balasubramanian Pranatharthi Haran1, Dennis Hausmann2, Paul Lemaire2, Kashish Sharma2, Pankaj Ramani2, Arpan Mahorowala
1IBM Research Center, 2Lam Research
Friday, July 9, 9:25-9:50 AM

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