New Article Highlights IoT Challenges and Opportunities
January 26, 2015
The coming “Internet of Things,” or IoT, holds promise to create a new world of extreme connectivity along with a host of exciting new technology …
Top Five Blog Articles of 2014
January 5, 2015
With the new year underway, we wanted to highlight some our most popular blog articles from 2014 – just in case you missed them. From …
The Value of Used Equipment from OEMs
November 10, 2014
The secondary equipment market is becoming more prevalent in today’s semiconductor manufacturing supply chain. Strong demand for older-model (“legacy”) tools continues to increase as chipmakers …
A Plasma State of Mind – Upcoming Conference Presentations
October 29, 2014
Plasma processing takes center stage every fall at the Gaseous Electronics Conference (GEC) and the AVS International Symposium. These conferences bring together experts from the …
Syndion® Milestone Shipment Highlights TSV Momentum
October 20, 2014
Recent news that through-silicon vias (TSVs) for 3D ICs are being adopted for commercial use coincides with momentum we are seeing with shipments of our …
Lam to Discuss Advances in Atomic-Scale Processing at Fall ECS
September 29, 2014
Experts from Lam’s deposition and etch product groups have been invited to speak on atomic-scale processing at the 2014 Electrochemical Society (ECS) and Sociedad Mexicana …
“Lam Day at MIT” Brings Together Students and Lam Technologists
September 17, 2014
The Massachusetts Institute of Technology (MIT) will host “Lam Day at MIT” at their Cambridge, Mass., campus on September 19, 2014. This all-day event is …
Advances in Wafer Cleaning To Be Presented at International Conference
September 15, 2014
The 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) will be held September 21-24 in Brussels, Belgium. This biannual conference brings together …
Lam to Discuss Electrochemical Deposition at Packaging Conference
July 28, 2014
Consumer demand for smaller, faster, and more powerful mobile electronics is driving innovations in semiconductor chip packaging, the tiny external connections for device input/output. The …
Lam Ships Its 2,000th VECTOR PECVD Module
July 21, 2014
Lam recently achieved an impressive product milestone with the shipment of our 2,000th VECTOR® PECVD module for dielectric film deposition (PECVD = plasma-enhanced chemical vapor …
Lam Awards Best Student Paper at AVS ALD Conference
July 16, 2014
Researchers from around the world come together each year at the AVS International Conference on Atomic Layer Deposition (ALD) to share advances in this critical …
Building Chips a Few Atoms at a Time
July 8, 2014
Did you know we’re building semiconductor chips with atoms? The tiny features on advanced devices are getting so small that atomic-scale processes are needed to …
New Workshop Spotlights Atomic Layer Etch
July 7, 2014
This spring Lam Research was among a small number of equipment companies to join device manufacturers, universities, and research institutions in San Francisco at SEMATECH’s …
Lam Experts to Present at SEMICON West TechXPOTs
June 30, 2014
Lam Research is gearing up for this year’s SEMICON® West and its accompanying technical events. This annual tradeshow, held at the Moscone Convention Center in …
Lam and imec Partner on Next-Generation Patterning and Metallization Solutions
June 27, 2014
Collaboration is increasingly important in the semiconductor industry as a way to develop new technologies and capabilities, while managing development costs. Over the years Lam …