Advances in Wafer Cleaning To Be Presented at International Conference
September 15, 2014
The 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) will be held September 21-24 in Brussels, Belgium. This biannual conference brings together …
Lam to Discuss Electrochemical Deposition at Packaging Conference
July 28, 2014
Consumer demand for smaller, faster, and more powerful mobile electronics is driving innovations in semiconductor chip packaging, the tiny external connections for device input/output. The …
Lam Ships Its 2,000th VECTOR PECVD Module
July 21, 2014
Lam recently achieved an impressive product milestone with the shipment of our 2,000th VECTOR® PECVD module for dielectric film deposition (PECVD = plasma-enhanced chemical vapor …
Lam Awards Best Student Paper at AVS ALD Conference
July 16, 2014
Researchers from around the world come together each year at the AVS International Conference on Atomic Layer Deposition (ALD) to share advances in this critical …
Building Chips a Few Atoms at a Time
July 8, 2014
Did you know we’re building semiconductor chips with atoms? The tiny features on advanced devices are getting so small that atomic-scale processes are needed to …
New Workshop Spotlights Atomic Layer Etch
July 7, 2014
This spring Lam Research was among a small number of equipment companies to join device manufacturers, universities, and research institutions in San Francisco at SEMATECH’s …
Lam Experts to Present at SEMICON West TechXPOTs
June 30, 2014
Lam Research is gearing up for this year’s SEMICON® West and its accompanying technical events. This annual tradeshow, held at the Moscone Convention Center in …
Lam and imec Partner on Next-Generation Patterning and Metallization Solutions
June 27, 2014
Collaboration is increasingly important in the semiconductor industry as a way to develop new technologies and capabilities, while managing development costs. Over the years Lam …