Lam Presentations at SEMICON West 2015
June 29, 2015
What does the future look like for semiconductor technology? For a peek at what’s on the horizon, head to SEMICON® West, the annual tradeshow held …
Every Atom Matters at These Conferences
June 15, 2015
Experts in the atomic-scale processing community will soon assemble at the AVS ALD 2015 Conference and the ALE Workshop to share advances in fundamental understanding …
Tastes of ALE: New Articles on Atomic Layer Etching
June 1, 2015
Interest in atomic layer etching (ALE) is intensifying as it emerges as an enabling technique for advanced etch applications. As features on a chip continue …
Collaboration Leads to Promising New Metallization Approach
May 19, 2015
Joint research in the semiconductor industry often drives innovative solutions for future technology nodes and is particularly valuable for exploring options several generations – and …
Etch Performance Plus Productivity – Enabling Advanced Memory Manufacturing
May 13, 2015
As manufacturers move to high-volume production for 3D NAND and advanced DRAM, chips must be fabricated quickly with repeatable results for every device on every …
Connect with Interconnect Experts at IITC/MAM
May 11, 2015
Lam is gearing up for a number of exciting activities at an upcoming joint conference on interconnects, metallization, and 3D integration. The IEEE International Interconnect …
Success at 10 nm – What Will It Take?
April 13, 2015
Achieving incredibly small dimensions for next-generation chips will involve new technologies with more stringent specifications. For one thing, greater control of process variability will be …
Tech Brief: Multiple Patterning Makes Miniaturization Possible
March 23, 2015
Have you ever wondered how everyday electronics, like smartphones and tablets, pack so much functionality into such relatively small and lightweight packages? If so, here’s …
Spotlight on Patterning at SPIE Symposium
February 9, 2015
Advanced patterning and atomic-scale processing will be the focus of an upcoming conference on nanopatterning during this year’s SPIE Advanced Lithography Symposium (February 22–26, San …
New Article Highlights IoT Challenges and Opportunities
January 26, 2015
The coming “Internet of Things,” or IoT, holds promise to create a new world of extreme connectivity along with a host of exciting new technology …
Top Five Blog Articles of 2014
January 5, 2015
With the new year underway, we wanted to highlight some our most popular blog articles from 2014 – just in case you missed them. From …
The Value of Used Equipment from OEMs
November 10, 2014
The secondary equipment market is becoming more prevalent in today’s semiconductor manufacturing supply chain. Strong demand for older-model (“legacy”) tools continues to increase as chipmakers …
A Plasma State of Mind – Upcoming Conference Presentations
October 29, 2014
Plasma processing takes center stage every fall at the Gaseous Electronics Conference (GEC) and the AVS International Symposium. These conferences bring together experts from the …
Syndion® Milestone Shipment Highlights TSV Momentum
October 20, 2014
Recent news that through-silicon vias (TSVs) for 3D ICs are being adopted for commercial use coincides with momentum we are seeing with shipments of our …
Lam to Discuss Advances in Atomic-Scale Processing at Fall ECS
September 29, 2014
Experts from Lam’s deposition and etch product groups have been invited to speak on atomic-scale processing at the 2014 Electrochemical Society (ECS) and Sociedad Mexicana …
“Lam Day at MIT” Brings Together Students and Lam Technologists
September 17, 2014
The Massachusetts Institute of Technology (MIT) will host “Lam Day at MIT” at their Cambridge, Mass., campus on September 19, 2014. This all-day event is …
Advances in Wafer Cleaning To Be Presented at International Conference
September 15, 2014
The 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) will be held September 21-24 in Brussels, Belgium. This biannual conference brings together …
Lam to Discuss Electrochemical Deposition at Packaging Conference
July 28, 2014
Consumer demand for smaller, faster, and more powerful mobile electronics is driving innovations in semiconductor chip packaging, the tiny external connections for device input/output. The …
Lam Ships Its 2,000th VECTOR PECVD Module
July 21, 2014
Lam recently achieved an impressive product milestone with the shipment of our 2,000th VECTOR® PECVD module for dielectric film deposition (PECVD = plasma-enhanced chemical vapor …
Lam Awards Best Student Paper at AVS ALD Conference
July 16, 2014
Researchers from around the world come together each year at the AVS International Conference on Atomic Layer Deposition (ALD) to share advances in this critical …