Resolving Process Variation Challenges in Multiple Patterning
September 11, 2017
Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process …
Market Momentum and Opportunities Connect at SEMICON Taiwan
September 5, 2017
The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected …
Rising Need for Vertical Scaling in a Data-Driven World
August 28, 2017
“Data is giving rise to a new economy” – The Economist (2017). This compelling reality makes the continued development of high-capacity data storage technologies like …
New Corvus Technology Takes Uniformity Control to the Edge
August 7, 2017
Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this …
Overcoming Challenges in 3D NAND Volume Manufacturing
July 31, 2017
The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per …
ALD/ALE 2017 to Showcase Advances in Atomic-Scale Processing
July 10, 2017
The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications …
SEMICON West Aims to Shake Things Up in San Francisco
July 3, 2017
If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West …
Enabling Advanced ICs with Multiple Patterning
June 12, 2017
Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly …
Tech Brief: A Look at Atomic Layer Deposition (ALD)
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Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …
SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities
April 10, 2017
Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important …
Technology and Economic Considerations for Panel-Level Fan-Out Packaging
April 3, 2017
Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …
Gearing Up for SEMICON China 2017
March 6, 2017
In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking …
Focus on Next-Gen Chipmaking at SPIE Advanced Lithography Symposium
February 21, 2017
It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits …
SEMICON Korea to Explore Latest Technology Advances
February 6, 2017
For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, …
Tech Brief: Primer on Packaging
January 17, 2017
Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. …
SEMICON Japan to Showcase Manufacturing Innovations
December 12, 2016
This year marks the 40th anniversary for SEMICON Japan, one of the most extensive international exhibitions of semiconductor equipment and materials. Each SEMI tradeshow has …
Continued Scaling with Multiple Patterning
November 28, 2016
Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other …
Tech Brief: All About ALE
November 14, 2016
Greek philosopher Democritus (460-370 BC) first proposed the existence of an ultimate particle, which he described as “atomos.” He probably never dreamed that one day …
AVS Symposium – Plasma Research and Thin Film Science
November 7, 2016
State-of-the-art advances in plasma research and thin film science will be discussed at the AVS 63rd International Symposium and Exhibition, being held November 6-11 in …
PRiME 2016 Conference Preview
September 26, 2016
Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research …