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Lam Blog

Connect with Interconnect Experts at IITC/MAM

May 11, 2015

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Technology

Lam is gearing up for a number of exciting activities at an upcoming joint conference on interconnects, metallization, and 3D integration. The IEEE International Interconnect …

Success at 10 nm – What Will It Take?

April 13, 2015

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Technology

Achieving incredibly small dimensions for next-generation chips will involve new technologies with more stringent specifications. For one thing, greater control of process variability will be …

Tech Brief: Multiple Patterning Makes Miniaturization Possible

March 23, 2015

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Industry, Technology

Have you ever wondered how everyday electronics, like smartphones and tablets, pack so much functionality into such relatively small and lightweight packages? If so, here’s …

Spotlight on Patterning at SPIE Symposium

February 9, 2015

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Technology

Advanced patterning and atomic-scale processing will be the focus of an upcoming conference on nanopatterning during this year’s SPIE Advanced Lithography Symposium (February 22–26, San …

New Article Highlights IoT Challenges and Opportunities

January 26, 2015

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Technology

The coming “Internet of Things,” or IoT, holds promise to create a new world of extreme connectivity along with a host of exciting new technology …

Top Five Blog Articles of 2014

January 5, 2015

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Corporate, Technology

With the new year underway, we wanted to highlight some our most popular blog articles from 2014 – just in case you missed them. From …

The Value of Used Equipment from OEMs

November 10, 2014

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Corporate, Technology

The secondary equipment market is becoming more prevalent in today’s semiconductor manufacturing supply chain. Strong demand for older-model (“legacy”) tools continues to increase as chipmakers …

A Plasma State of Mind – Upcoming Conference Presentations

October 29, 2014

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Technology

Plasma processing takes center stage every fall at the Gaseous Electronics Conference (GEC) and the AVS International Symposium. These conferences bring together experts from the …

Syndion® Milestone Shipment Highlights TSV Momentum

October 20, 2014

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Corporate, Technology

Recent news that through-silicon vias (TSVs) for 3D ICs are being adopted for commercial use coincides with momentum we are seeing with shipments of our …

Lam to Discuss Advances in Atomic-Scale Processing at Fall ECS

September 29, 2014

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Technology

Experts from Lam’s deposition and etch product groups have been invited to speak on atomic-scale processing at the 2014 Electrochemical Society (ECS) and Sociedad Mexicana …

“Lam Day at MIT” Brings Together Students and Lam Technologists

September 17, 2014

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Life at Lam, Technology

The Massachusetts Institute of Technology (MIT) will host “Lam Day at MIT” at their Cambridge, Mass., campus on September 19, 2014. This all-day event is …

Advances in Wafer Cleaning To Be Presented at International Conference

September 15, 2014

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Technology

The 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) will be held September 21-24 in Brussels, Belgium. This biannual conference brings together …

Lam to Discuss Electrochemical Deposition at Packaging Conference

July 28, 2014

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Technology

Consumer demand for smaller, faster, and more powerful mobile electronics is driving innovations in semiconductor chip packaging, the tiny external connections for device input/output. The …

Lam Ships Its 2,000th VECTOR PECVD Module

July 21, 2014

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Technology

Lam recently achieved an impressive product milestone with the shipment of our 2,000th VECTOR® PECVD module for dielectric film deposition (PECVD = plasma-enhanced chemical vapor …

Lam Awards Best Student Paper at AVS ALD Conference

July 16, 2014

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Community, Technology

Researchers from around the world come together each year at the AVS International Conference on Atomic Layer Deposition (ALD) to share advances in this critical …

Building Chips a Few Atoms at a Time

July 8, 2014

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Technology

Did you know we’re building semiconductor chips with atoms? The tiny features on advanced devices are getting so small that atomic-scale processes are needed to …

New Workshop Spotlights Atomic Layer Etch

July 7, 2014

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Technology

This spring Lam Research was among a small number of equipment companies to join device manufacturers, universities, and research institutions in San Francisco at SEMATECH’s …

Lam Experts to Present at SEMICON West TechXPOTs

June 30, 2014

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Technology

Lam Research is gearing up for this year’s SEMICON® West and its accompanying technical events. This annual tradeshow, held at the Moscone Convention Center in …

Lam and imec Partner on Next-Generation Patterning and Metallization Solutions

June 27, 2014

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Corporate, Technology

Collaboration is increasingly important in the semiconductor industry as a way to develop new technologies and capabilities, while managing development costs. Over the years Lam …

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