A Sense of Scale: How Small Is Small?
February 1, 2016
One of the most astounding aspects of semiconductor chips is their incredibly small scale. Practically measured in atoms, some feature dimensions are on the order …
Looking Ahead to 2016
January 18, 2016
With the new year underway, you may be wondering what lies ahead for the semiconductor world. Once again, Solid State Technology has checked in with …
Journal Papers Showcase Research at Lam
January 11, 2016
From materials research to plasma fundamentals, Lam’s technologists are contributing to practical and theoretical developments in their fields. One way they help advance technology and …
Heading to the 2015 AVS Symposium
October 12, 2015
Each autumn, scientists and engineers from around the globe look forward to discussing the latest advances in materials, surfaces, interfaces, and processing at the week-long …
A 35-Year Perspective – Lam’s Technologies
October 5, 2015
Since first opening our doors in 1980, we have significantly expanded the markets and applications that our products and technologies serve. In this final article …
Cool Chemistry on Stage at ECS Fall Meeting
September 28, 2015
What do thin film deposition, plasma etch, and wafer cleaning have in common? They all involve cutting-edge chemistry and they will all be on stage …
A Glimpse Into the World of Engineers
September 8, 2015
Remember the curiosity you had about your first science experiment in school? Engineers feel that same excitement in their jobs every day at Lam – …
SEMICON Taiwan to Explore IoT, 3D, and “Moore”
August 24, 2015
This year marks the 20th anniversary of SEMICON Taiwan, the premier event in Taiwan for semiconductor manufacturing. With its large global fab capacity, Taiwan is …
Chip Industry’s Unprecedented Pace of Innovation
August 17, 2015
No other industry even comes close to the extraordinary rate of technology advancement that takes place in the semiconductor industry. Without this pace of innovation, …
Etch Milestone Highlights Advanced Variability Control
July 13, 2015
To create smaller and denser features for advanced devices, chipmakers are turning to multiple patterning techniques. Because these are multi-step processes, managing variability is critical …
New Products Enable Inflections for Advanced Devices
July 13, 2015
Deposition and etch processes play vital roles in enabling technology inflections like multiple patterning and 3D structures that are used to create smaller, faster, and …
University of Texas and Lam Collaboration Accelerates Learning
July 6, 2015
The semiconductor business is moving at an increasingly fast pace, and the need to develop new technologies for future chip generations is driving advanced research. …
Lam Presentations at SEMICON West 2015
June 29, 2015
What does the future look like for semiconductor technology? For a peek at what’s on the horizon, head to SEMICON® West, the annual tradeshow held …
Every Atom Matters at These Conferences
June 15, 2015
Experts in the atomic-scale processing community will soon assemble at the AVS ALD 2015 Conference and the ALE Workshop to share advances in fundamental understanding …
Tastes of ALE: New Articles on Atomic Layer Etching
June 1, 2015
Interest in atomic layer etching (ALE) is intensifying as it emerges as an enabling technique for advanced etch applications. As features on a chip continue …
Collaboration Leads to Promising New Metallization Approach
May 19, 2015
Joint research in the semiconductor industry often drives innovative solutions for future technology nodes and is particularly valuable for exploring options several generations – and …
Etch Performance Plus Productivity – Enabling Advanced Memory Manufacturing
May 13, 2015
As manufacturers move to high-volume production for 3D NAND and advanced DRAM, chips must be fabricated quickly with repeatable results for every device on every …
Connect with Interconnect Experts at IITC/MAM
May 11, 2015
Lam is gearing up for a number of exciting activities at an upcoming joint conference on interconnects, metallization, and 3D integration. The IEEE International Interconnect …
Success at 10 nm – What Will It Take?
April 13, 2015
Achieving incredibly small dimensions for next-generation chips will involve new technologies with more stringent specifications. For one thing, greater control of process variability will be …
Tech Brief: Multiple Patterning Makes Miniaturization Possible
March 23, 2015
Have you ever wondered how everyday electronics, like smartphones and tablets, pack so much functionality into such relatively small and lightweight packages? If so, here’s …