Innovative Tungsten ALD Process Provides Pathway to New Memory Chip Production
August 9, 2016
Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process …
Multipatterning Poses Process Challenges
August 1, 2016
Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of …
ALD Conference and ALE Workshop Explore Nanoscale Processing
July 25, 2016
Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more …
Evolution of Uniformity Control: Looking Back and Peeking Ahead
July 18, 2016
The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, …
Test Your Knowledge of Semiconductor Terms
July 11, 2016
The semiconductor industry uses so many unique terms, it practically has its own language. To keep up on the latest developments, knowing that “language” can …
SEMICON West Explores Latest Technologies and Trends
June 27, 2016
What’s left after the relatively easy semiconductor manufacturing issues have been solved? The wicked hard problems – including things like scaling transistors down to 5 …
Perspectives on Advanced Interconnect Developments
June 20, 2016
Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to …
One-on-One with Lam’s CTO – 3D NAND, Quantum Effects, and More
May 23, 2016
Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, …
IITC/AMC to Explore Advances in Interconnect Materials and Processing
May 16, 2016
The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on …
Spotlight on Packaging and IoT at SEMICON Southeast Asia
April 25, 2016
Building on its inaugural success last year, this year’s SEMICON Southeast Asia 2016 takes place April 26-28 at the SPICE Arena in Penang, Malaysia. Lam …
Tech Brief: Memory “Grows Up” with 3D NAND
April 11, 2016
Since its introduction in the 1980s, NAND flash memory has radically changed how we store our digital data. Remember ordering duplicate photos when getting camera …
SEMICON China to Showcase Semiconductor Industry
March 4, 2016
The global semiconductor industry will be heading to the Shanghai New International Expo Centre for this year’s SEMICON China, which takes place March 15-17. Held …
Tech Brief: The Role of Technology Inflections
February 29, 2016
We often hear the word “inflection” used in the semiconductor industry, but what does it mean? In general, inflection refers to a point of change. …
Latest Developments in Advanced Lithography on Stage at SPIE Symposium
February 15, 2016
Is Moore’s Law still on track? Can transistors, already more than a thousand times smaller than a grain of sand, continue to get even smaller? …
A Sense of Scale: How Small Is Small?
February 1, 2016
One of the most astounding aspects of semiconductor chips is their incredibly small scale. Practically measured in atoms, some feature dimensions are on the order …
Looking Ahead to 2016
January 18, 2016
With the new year underway, you may be wondering what lies ahead for the semiconductor world. Once again, Solid State Technology has checked in with …
Journal Papers Showcase Research at Lam
January 11, 2016
From materials research to plasma fundamentals, Lam’s technologists are contributing to practical and theoretical developments in their fields. One way they help advance technology and …
Heading to the 2015 AVS Symposium
October 12, 2015
Each autumn, scientists and engineers from around the globe look forward to discussing the latest advances in materials, surfaces, interfaces, and processing at the week-long …
A 35-Year Perspective – Lam’s Technologies
October 5, 2015
Since first opening our doors in 1980, we have significantly expanded the markets and applications that our products and technologies serve. In this final article …
Cool Chemistry on Stage at ECS Fall Meeting
September 28, 2015
What do thin film deposition, plasma etch, and wafer cleaning have in common? They all involve cutting-edge chemistry and they will all be on stage …