Focus on Next-Gen Chipmaking at SPIE Advanced Lithography Symposium
February 21, 2017
It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits …
SEMICON Korea to Explore Latest Technology Advances
February 6, 2017
For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, …
Tech Brief: Primer on Packaging
January 17, 2017
Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. …
SEMICON Japan to Showcase Manufacturing Innovations
December 12, 2016
This year marks the 40th anniversary for SEMICON Japan, one of the most extensive international exhibitions of semiconductor equipment and materials. Each SEMI tradeshow has …
Continued Scaling with Multiple Patterning
November 28, 2016
Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other …
Tech Brief: All About ALE
November 14, 2016
Greek philosopher Democritus (460-370 BC) first proposed the existence of an ultimate particle, which he described as “atomos.” He probably never dreamed that one day …
AVS Symposium – Plasma Research and Thin Film Science
November 7, 2016
State-of-the-art advances in plasma research and thin film science will be discussed at the AVS 63rd International Symposium and Exhibition, being held November 6-11 in …
PRiME 2016 Conference Preview
September 26, 2016
Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research …
Tech Brief: FinFET Fundamentals
September 12, 2016
Transistors are at the heart of our cherished electronics. Millions, or even billions, of these tiny switches go to work for us when we check …
New Atomic Layer Etching Capability Enables Continued Device Scaling
September 6, 2016
With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric …
SEMICON Taiwan to Focus on Industry Future
August 29, 2016
The semiconductor manufacturing community is gearing up for SEMICON Taiwan, the largest microelectronics event in Taiwan, which is expected to attract more than 40,000 visitors …
Innovative Tungsten ALD Process Provides Pathway to New Memory Chip Production
August 9, 2016
Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process …
Multipatterning Poses Process Challenges
August 1, 2016
Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of …
ALD Conference and ALE Workshop Explore Nanoscale Processing
July 25, 2016
Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more …
Evolution of Uniformity Control: Looking Back and Peeking Ahead
July 18, 2016
The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, …
Test Your Knowledge of Semiconductor Terms
July 11, 2016
The semiconductor industry uses so many unique terms, it practically has its own language. To keep up on the latest developments, knowing that “language” can …
SEMICON West Explores Latest Technologies and Trends
June 27, 2016
What’s left after the relatively easy semiconductor manufacturing issues have been solved? The wicked hard problems – including things like scaling transistors down to 5 …
Perspectives on Advanced Interconnect Developments
June 20, 2016
Industry experts came together recently to discuss some of the critical challenges facing interconnect scaling. As the number of transistors on advanced chips continues to …
One-on-One with Lam’s CTO – 3D NAND, Quantum Effects, and More
May 23, 2016
Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, …
IITC/AMC to Explore Advances in Interconnect Materials and Processing
May 16, 2016
The continual scaling of device dimensions drives the need for ever smaller interconnects, the intricate wiring that links up to billions of individual components on …