Patterning and Lithography Experts Convene at SPIE Symposium
February 20, 2018
Continuing to make device components ever smaller and closely packed together is one of the challenges faced by the advanced patterning community every day. From …
Connect, Collaborate, and Innovate at SEMICON Korea
January 22, 2018
For more than thirty years, SEMICON Korea has been known as one of the largest semiconductor shows in the Korean semiconductor industry. This premier event …
Tech Brief: Much Ado About Memory
January 16, 2018
New semiconductor applications are ever changing and improving our lives, from new smartphones and wearables to healthcare, factory automation, and artificial intelligence. The humble memory …
Dreams Start at SEMICON Japan
December 4, 2017
As a premier exposition for the electronics manufacturing supply chain, SEMICON Japan will brighten up Tokyo this December with the theme “dreams start here.” The …
SEMICON Europa to Share Stage with Productronica in Munich
October 30, 2017
For the first time, SEMICON Europa will be co-located with productronica – one of the world’s leading trade fairs for electronics development and production – …
Atomic-Scale Processing Heats Up Tampa at the AVS Symposium
October 23, 2017
Some of the greatest minds in science and technology will be convening in Tampa for the 64th annual AVS International Symposium & Exhibition starting on …
Tech Brief: An Introduction to Interconnects
September 25, 2017
We often hear that advanced chips contain billions of transistors – an incredible, mind-blowing fact to be sure – but did you know that large-scale …
Fall ECS Meeting Committed to #FreeTheScience
September 20, 2017
Scientists, engineers, researchers, and industry professionals from around the globe will descend upon National Harbor, Maryland, this October to interact at the 232nd Electrochemical Society …
Resolving Process Variation Challenges in Multiple Patterning
September 11, 2017
Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process …
Market Momentum and Opportunities Connect at SEMICON Taiwan
September 5, 2017
The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected …
Rising Need for Vertical Scaling in a Data-Driven World
August 28, 2017
“Data is giving rise to a new economy” – The Economist (2017). This compelling reality makes the continued development of high-capacity data storage technologies like …
New Corvus Technology Takes Uniformity Control to the Edge
August 7, 2017
Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this …
Overcoming Challenges in 3D NAND Volume Manufacturing
July 31, 2017
The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per …
ALD/ALE 2017 to Showcase Advances in Atomic-Scale Processing
July 10, 2017
The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications …
SEMICON West Aims to Shake Things Up in San Francisco
July 3, 2017
If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West …
Enabling Advanced ICs with Multiple Patterning
June 12, 2017
Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly …
Tech Brief: A Look at Atomic Layer Deposition (ALD)
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Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …
SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities
April 10, 2017
Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important …
Technology and Economic Considerations for Panel-Level Fan-Out Packaging
April 3, 2017
Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …
Gearing Up for SEMICON China 2017
March 6, 2017
In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking …