Lam Announces New Atomic Layer Deposition Platform Featuring ICEFill™ Technology
September 21, 2020
In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio …
Fueling Next-Generation Semiconductors at SEMICON Taiwan
September 8, 2020
Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall …
Small, To Big, To Better
August 10, 2020
Diagnosis of any kind requires the synthesis of information. As humans we are much better at doing this when we have ways of visualizing information …
Connect at SEMICON Southeast Asia
August 3, 2020
SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights …
Lam Shapes Industry Agenda at SEMICON West
July 27, 2020
Lam CEO Tim Archer recently presented a compelling vision of the future at SEMICON West along with key industry leaders and influencers. Tim spoke of …
Lam at Virtual SEMICON West
July 6, 2020
The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes, exhibits, and networking …
Connect at SEMICON China 2020
June 30, 2020
A key semiconductor trade show and forum, SEMICON China, was held June 27–29 at the Shanghai New International Expo Centre. Lam was pleased to be …
Lam at ALD/ALE 2020 Virtual Meeting
June 15, 2020
The 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will take place Monday, June …
One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips
May 28, 2020
Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes …
Copper Electrodeposition for Fan-Out Wafer-Level Packaging
May 11, 2020
As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective …
CTO Perspective on a Data Driven World
March 16, 2020
Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference …
Lam Revolutionizes Chipmaking Process with New Plasma Etching System
March 3, 2020
Building on four decades of etch industry leadership, Lam today launched a new plasma etch technology and system solution. The new Sense.i™ platform features Lam’s …
Lam Introduces EUV Lithography Technology Breakthrough
February 26, 2020
Addressing critical needs for next-generation device scaling, Lam today introduced a new dry photoresist technology that offers significant improvement in EUV lithography resolution, productivity and …
Patterning Symposium: Connecting Minds, Advancing Light
February 10, 2020
The full spectrum of patterning topics will be discussed at the upcoming SPIE Advanced Lithography symposium. Held at the San Jose Convention Center on February …
Smarter Future on Stage at SEMICON Korea
January 13, 2020
[Notice] SEMICON KOREA 2020 Is Canceled SEMICON Korea 2020, which was scheduled to be held from Feb 5 to Feb 7 by SEMI KOREA, will …
2019 Blog Review: Top Posts of the Year
January 6, 2020
2019 was quite a year for the Lam Blog. From sharing an inside peek at our favorite day of the year, Bring Our Children to …
Leveraging 300 mm Technologies at 200 mm for IoT and Automotive
December 16, 2019
The IoT and automotive markets use devices fabricated at a wide range of technology nodes. Taking advances made at 300 mm and applying them via …
Lam Extends Leadership in Edge Control Solutions
December 3, 2019
Addressing the critical need for higher wafer edge yield, Lam has introduced new capabilities in its Corvus® etch and Coronus® plasma bevel clean systems.
Making the Impossible Possible Through Cross-Institutional Collaboration
November 22, 2019
It is an exciting time to be in the semiconductor industry and driving technology development which is fueling the intelligent, interconnected systems that will transform …
Nanoscale Features through Atomic Scale Processing
November 18, 2019
Atomic layer etching and deposition processes offer atomic scale control through the use of self-limiting reactions. Yang Pan, corporate vice president of advanced technology development, …