Lam Blog

Fall ECS Meeting Committed to #FreeTheScience

September 20, 2017

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Technology

Scientists, engineers, researchers, and industry professionals from around the globe will descend upon National Harbor, Maryland, this October to interact at the 232nd Electrochemical Society (ECS) Fall Meeting, which focuses on electrochemical and solid-state science and technology. Through their new initiative to #FreeTheScience, ECS will undertake the groundbreaking endeavor of publishing all their science research as open-access and will host an ECS OpenCon in conjunction with the 2017 Fall Meeting. These activities not only further the advancement of science being used to address global sustainability challenges, but also provide resources for sharing research through training and support from the industry’s best thought leaders and emerging scientists.

Resolving Process Variation Challenges in Multiple Patterning

September 11, 2017

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Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process …

Market Momentum and Opportunities Connect at SEMICON Taiwan

September 5, 2017

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The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected …

Rising Need for Vertical Scaling in a Data-Driven World

August 28, 2017

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Industry, Technology

“Data is giving rise to a new economy” – The Economist (2017). This compelling reality makes the continued development of high-capacity data storage technologies like …

New Corvus Technology Takes Uniformity Control to the Edge

August 7, 2017

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Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this …

Overcoming Challenges in 3D NAND Volume Manufacturing

July 31, 2017

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The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per …

ALD/ALE 2017 to Showcase Advances in Atomic-Scale Processing

July 10, 2017

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The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications …

SEMICON West Aims to Shake Things Up in San Francisco

July 3, 2017

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If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West …

Enabling Advanced ICs with Multiple Patterning

June 12, 2017

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Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly …

Tech Brief: A Look at Atomic Layer Deposition (ALD)

May 15, 2017

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Industry, Technology

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …

SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities

April 10, 2017

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Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important …

Technology and Economic Considerations for Panel-Level Fan-Out Packaging

April 3, 2017

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Industry, Technology

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …

Gearing Up for SEMICON China 2017

March 6, 2017

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In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking …

Focus on Next-Gen Chipmaking at SPIE Advanced Lithography Symposium

February 21, 2017

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It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits …

SEMICON Korea to Explore Latest Technology Advances

February 6, 2017

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For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, …

Tech Brief: Primer on Packaging

January 17, 2017

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Industry, Technology

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. …

Flashback to 2016

January 3, 2017

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Industry, Technology

Happy New Year and welcome back to the Lam Blog! For our first article of 2017, we wanted to share a few of our most …

SEMICON Japan to Showcase Manufacturing Innovations

December 12, 2016

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This year marks the 40th anniversary for SEMICON Japan, one of the most extensive international exhibitions of semiconductor equipment and materials. Each SEMI tradeshow has …

Continued Scaling with Multiple Patterning

November 28, 2016

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Industry, Technology

Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other …

Tech Brief: All About ALE

November 14, 2016

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Industry, Technology

Greek philosopher Democritus (460-370 BC) first proposed the existence of an ultimate particle, which he described as “atomos.” He probably never dreamed that one day …

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