Lam Blog

Patterning and Lithography Experts Convene at SPIE Symposium

February 20, 2018

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Technology

Continuing to make device components ever smaller and closely packed together is one of the challenges faced by the advanced patterning community every day. From February 25 to March 1, experts in the field will gather at the SPIE Advanced Lithography Symposium in San Jose, CA, to share ideas and innovations. A full spectrum of patterning and lithography topics will be discussed at this year’s symposium across seven conferences. Attendees will come together to share and learn about state-of-the-art lithography, novel patterning technologies, metrology and process control, etch, patterning materials, and more.

Connect, Collaborate, and Innovate at SEMICON Korea

January 22, 2018

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For more than thirty years, SEMICON Korea has been known as one of the largest semiconductor shows in the Korean semiconductor industry. This premier event …

Tech Brief: Much Ado About Memory

January 16, 2018

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Industry, Technology

New semiconductor applications are ever changing and improving our lives, from new smartphones and wearables to healthcare, factory automation, and artificial intelligence. The humble memory …

Lucky 7: Seven Blog Favorites from 2017

January 2, 2018

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Industry, Technology

Welcome back to the Lam Blog. We hope you had a happy and prosperous holiday season. As a prelude to what you can expect in …

Dreams Start at SEMICON Japan

December 4, 2017

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As a premier exposition for the electronics manufacturing supply chain, SEMICON Japan will brighten up Tokyo this December with the theme “dreams start here.” The …

SEMICON Europa to Share Stage with Productronica in Munich

October 30, 2017

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Technology

For the first time, SEMICON Europa will be co-located with productronica – one of the world’s leading trade fairs for electronics development and production – …

Atomic-Scale Processing Heats Up Tampa at the AVS Symposium

October 23, 2017

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Some of the greatest minds in science and technology will be convening in Tampa for the 64th annual AVS International Symposium & Exhibition starting on …

Tech Brief: An Introduction to Interconnects

September 25, 2017

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Industry, Technology

We often hear that advanced chips contain billions of transistors – an incredible, mind-blowing fact to be sure – but did you know that large-scale …

Fall ECS Meeting Committed to #FreeTheScience

September 20, 2017

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Scientists, engineers, researchers, and industry professionals from around the globe will descend upon National Harbor, Maryland, this October to interact at the 232nd Electrochemical Society …

Resolving Process Variation Challenges in Multiple Patterning

September 11, 2017

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Technology

Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process …

Market Momentum and Opportunities Connect at SEMICON Taiwan

September 5, 2017

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The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected …

Rising Need for Vertical Scaling in a Data-Driven World

August 28, 2017

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Industry, Technology

“Data is giving rise to a new economy” – The Economist (2017). This compelling reality makes the continued development of high-capacity data storage technologies like …

New Corvus Technology Takes Uniformity Control to the Edge

August 7, 2017

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Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this …

Overcoming Challenges in 3D NAND Volume Manufacturing

July 31, 2017

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The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per …

ALD/ALE 2017 to Showcase Advances in Atomic-Scale Processing

July 10, 2017

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The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications …

SEMICON West Aims to Shake Things Up in San Francisco

July 3, 2017

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If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West …

Enabling Advanced ICs with Multiple Patterning

June 12, 2017

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Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly …

Tech Brief: A Look at Atomic Layer Deposition (ALD)

May 15, 2017

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Industry, Technology

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …

SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities

April 10, 2017

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Technology

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important …

Technology and Economic Considerations for Panel-Level Fan-Out Packaging

April 3, 2017

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Industry, Technology

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …

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