Chipmakers Achieve Higher Equipment Availability with Lam’s WCO
June 21, 2021
“What is wet, but dry?” might sound like a riddle, and the answer for plasma process tools are “wet cleans,” an important type of preventative maintenance. The term “wet clean” comes from the early days of the industry when preventative maintenance meant disassembling the reaction chamber, submerging the quartz parts in acids, rinsing, drying and then reassembling the chamber. In today’s high precision maintenance for process tools the only wet chemistry usually used is a lint-free wipe, moistened with deionized-water, but the name persists. So, maintenance is called “wet,” but is actually “dry.”
ALD/ALE 2021 to Showcase Atomic-Scale Processing
June 14, 2021
Chip features continue to shrink to incredibly small dimensions and different device architectures are being devised to supply consumers with more powerful electronics. Atomic layer deposition (ALD) and atomic …
The Four Pillars of Lam Equipment Intelligence®
June 7, 2021
The pervasive use of technology has brought about a tremendous growth in data as well as an explosion in scaling and complexity of integrated circuits. …
Happy Golden Anniversary to the Microprocessor
June 1, 2021
We take microprocessors for granted. Most people who aren’t deeply involved in technology may have no idea all of the places where a microprocessor shows …
Lam Participation at ECS Spring Meeting
May 24, 2021
Engineers, scientists, and industry professionals will attend the 239th Electrochemistry Society (ECS) Meeting and the 18th International Meeting on Chemical Sensors (IMCS), held May 30 to June …
Lam Silicon Parts Drive Memory Success
May 10, 2021
Silicon chip manufacturing has always included etching as a critical processing step. But, increasingly, extremely high-aspect-ratio etching has been needed for 3D flash and DRAM chips, …
Why New Photoresist Technology Is Critical
March 1, 2021
As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to…
Lam’s University Engagements: Innovation Through Collaboration
February 22, 2021
Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards…
Advanced Patterning on Stage at SPIE Symposium
February 16, 2021
The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps…
Revolutionizing Memory Manufacturing with Vantex™
January 27, 2021
With more than a decade of industry leadership in high aspect ratio etching, Lam now introduces Vantex™, the latest in dielectric etch technology. Designed from the ground …
Accelerating Innovation at SEMICON Korea
January 19, 2021
To kick-off the new year, SEMICON Korea is bringing together industry leaders throughout the semiconductor supply chain. Held February 3-12, participants can learn more about artificial intelligence, MEMS…
Our Favorite Articles from 2020
January 4, 2021
To kick-off the new year, we thought we’d share some of our favorite stories from 2020. While not exhaustive, this short list features articles that …
ALD Technology Fills Taller Memory
November 30, 2020
Filling complex, high aspect ratio structures is a challenge for 3D NAND, DRAM, and logic chipmakers. Lam’s Aaron Fellis, vice president and general manager of …
FinFETs Give Way to Gate-All-Around
October 26, 2020
When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in …
Winning the Global Race for Semiconductor Technology with Virtual Process Modeling
October 19, 2020
Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming …
Lam Introduces New Photoresist Strip Capability for 200 mm
October 12, 2020
Lam’s newest product in its line of GAMMA® dry photoresist strip systems, brings the performance of the GAMMA® GxT® 300 mm to 200 mm wafer …
Lam Announces New Atomic Layer Deposition Platform Featuring ICEFill™ Technology
September 21, 2020
In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio …
Fueling Next-Generation Semiconductors at SEMICON Taiwan
September 8, 2020
Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall …
Small, To Big, To Better
August 10, 2020
Diagnosis of any kind requires the synthesis of information. As humans we are much better at doing this when we have ways of visualizing information …
Connect at SEMICON Southeast Asia
August 3, 2020
SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights …