Why New Photoresist Technology Is Critical
March 1, 2021
As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. One of the major roadblocks involves the material used to …
Lam’s University Engagements: Innovation Through Collaboration
February 22, 2021
Lam Research collaborates with universities and academic research consortia by supporting research, building relationships, and assisting graduate and undergraduate students with thesis awards, scholarships, and …
Advanced Patterning on Stage at SPIE Symposium
February 16, 2021
The latest developments in patterning will be on stage at the upcoming SPIE Advanced Lithography, held as a digital forum February 22-26. Patterning – the set of steps …
Revolutionizing Memory Manufacturing with Vantex™
January 27, 2021
With more than a decade of industry leadership in high aspect ratio etching, Lam now introduces Vantex™, the latest in dielectric etch technology. Designed from the ground …
Accelerating Innovation at SEMICON Korea
January 19, 2021
To kick-off the new year, SEMICON Korea is bringing together industry leaders throughout the semiconductor supply chain. Held February 3-12, participants can learn more about artificial intelligence, MEMS and sensors, and …
Our Favorite Articles from 2020
January 4, 2021
To kick-off the new year, we thought we’d share some of our favorite stories from 2020. While not exhaustive, this short list features articles that …
ALD Technology Fills Taller Memory
November 30, 2020
Filling complex, high aspect ratio structures is a challenge for 3D NAND, DRAM, and logic chipmakers. Lam’s Aaron Fellis, vice president and general manager of …
FinFETs Give Way to Gate-All-Around
October 26, 2020
When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in …
Winning the Global Race for Semiconductor Technology with Virtual Process Modeling
October 19, 2020
Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming …
Lam Introduces New Photoresist Strip Capability for 200 mm
October 12, 2020
Lam’s newest product in its line of GAMMA® dry photoresist strip systems, brings the performance of the GAMMA® GxT® 300 mm to 200 mm wafer …
Lam Announces New Atomic Layer Deposition Platform Featuring ICEFill™ Technology
September 21, 2020
In today’s press release below, Lam announced the new Striker® FE platform featuring its patented ICEFill™ technology, which provides bottom-up filling in complex high aspect ratio …
Fueling Next-Generation Semiconductors at SEMICON Taiwan
September 8, 2020
Taiwan’s largest semiconductor convention is bringing together the industry’s brightest minds for a three-day exhibition. Held September 23-25 at the Taipei Nangang Exhibition Center, Hall …
Small, To Big, To Better
August 10, 2020
Diagnosis of any kind requires the synthesis of information. As humans we are much better at doing this when we have ways of visualizing information …
Connect at SEMICON Southeast Asia
August 3, 2020
SEMICON Southeast Asia, the region’s premier electronics manufacturing supply chain exposition and conference, has gone virtual. Industry experts from around the world will share insights …
Lam Shapes Industry Agenda at SEMICON West
July 27, 2020
Lam CEO Tim Archer recently presented a compelling vision of the future at SEMICON West along with key industry leaders and influencers. Tim spoke of …
Lam at Virtual SEMICON West
July 6, 2020
The semiconductor industry’s flagship event, SEMICON West, is going virtual this year. Celebrating its 50th year, the show promises a full exhibition experience, featuring high level keynotes, exhibits, and networking …
Connect at SEMICON China 2020
June 30, 2020
A key semiconductor trade show and forum, SEMICON China, was held June 27–29 at the Shanghai New International Expo Centre. Lam was pleased to be …
Lam at ALD/ALE 2020 Virtual Meeting
June 15, 2020
The 20th International Conference on Atomic Layer Deposition (ALD 2020) featuring the 7th International Atomic Layer Etching Workshop (ALE 2020) will take place Monday, June …
One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips
May 28, 2020
Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes …
Copper Electrodeposition for Fan-Out Wafer-Level Packaging
May 11, 2020
As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective …