Lam Blog

SEMICON Europa to Share Stage with Productronica in Munich

October 30, 2017

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Technology

For the first time, SEMICON Europa will be co-located with productronica – one of the world’s leading trade fairs for electronics development and production – …

Atomic-Scale Processing Heats Up Tampa at the AVS Symposium

October 23, 2017

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Technology

Some of the greatest minds in science and technology will be convening in Tampa for the 64th annual AVS International Symposium & Exhibition starting on …

Tech Brief: An Introduction to Interconnects

September 25, 2017

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Industry, Technology

We often hear that advanced chips contain billions of transistors – an incredible, mind-blowing fact to be sure – but did you know that large-scale …

Fall ECS Meeting Committed to #FreeTheScience

September 20, 2017

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Technology

Scientists, engineers, researchers, and industry professionals from around the globe will descend upon National Harbor, Maryland, this October to interact at the 232nd Electrochemical Society …

Resolving Process Variation Challenges in Multiple Patterning

September 11, 2017

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Technology

Multiple patterning continues to be an important technique for enabling pitch shrinking in advanced chip designs. However, as the number of steps grows, managing process …

Market Momentum and Opportunities Connect at SEMICON Taiwan

September 5, 2017

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Technology

The semiconductor manufacturing community is ready to connect at SEMICON Taiwan, the premier event for microelectronics manufacturing in Taiwan. This year, the event is expected …

Rising Need for Vertical Scaling in a Data-Driven World

August 28, 2017

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Industry, Technology

“Data is giving rise to a new economy” – The Economist (2017). This compelling reality makes the continued development of high-capacity data storage technologies like …

New Corvus Technology Takes Uniformity Control to the Edge

August 7, 2017

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Technology

Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this …

Overcoming Challenges in 3D NAND Volume Manufacturing

July 31, 2017

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Technology

The industry’s transition to 3D NAND is being driven by several important advantages, including its ability to deliver higher capacity with a lower cost per …

ALD/ALE 2017 to Showcase Advances in Atomic-Scale Processing

July 10, 2017

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Technology

The demands of our modern world for more connectivity, functionality, and capacity from our electronic devices – alongside the seemingly endless imagination for new applications …

SEMICON West Aims to Shake Things Up in San Francisco

July 3, 2017

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Technology

If you’re part of the semiconductor industry, you know there are few better networking and technical sharing venues than the SEMICON tradeshows, and SEMICON West …

Enabling Advanced ICs with Multiple Patterning

June 12, 2017

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Technology

Used to extend the capabilities of conventional lithography, multiple patterning is a process of overlaying patterns of larger dimensions to achieve smaller and/or more tightly …

Tech Brief: A Look at Atomic Layer Deposition (ALD)

May 15, 2017

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Industry, Technology

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …

SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities

April 10, 2017

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Technology

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important …

Technology and Economic Considerations for Panel-Level Fan-Out Packaging

April 3, 2017

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Industry, Technology

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …

Gearing Up for SEMICON China 2017

March 6, 2017

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Technology

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking …

Focus on Next-Gen Chipmaking at SPIE Advanced Lithography Symposium

February 21, 2017

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Technology

It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits …

SEMICON Korea to Explore Latest Technology Advances

February 6, 2017

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Technology

For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, …

Tech Brief: Primer on Packaging

January 17, 2017

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Industry, Technology

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. …

Flashback to 2016

January 3, 2017

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Industry, Technology

Happy New Year and welcome back to the Lam Blog! For our first article of 2017, we wanted to share a few of our most …

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