One-on-One with Lam CTO Rick Gottscho: Challenges in Stacking, Shrinking, and Inspecting Next-Gen Chips
May 28, 2020
Lam Chief Technology Officer Rick Gottscho sat down with Semiconductor Engineering to share his insights on memory and equipment scaling, new market demands, and changes in manufacturing being driven by cost, new technologies, and the application of machine learning. Below, we share some excerpts from the article.
Copper Electrodeposition for Fan-Out Wafer-Level Packaging
May 11, 2020
By Steven T. Mayer, Bryan Buckalew, and Kari Thorkelsson As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D …
CTO Perspective on a Data Driven World
March 16, 2020
Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference …
Lam Revolutionizes Chipmaking Process with New Plasma Etching System
March 3, 2020
Building on four decades of etch industry leadership, Lam today launched a new plasma etch technology and system solution. The new Sense.i™ platform features Lam’s …
Lam Introduces EUV Lithography Technology Breakthrough
February 26, 2020
Addressing critical needs for next-generation device scaling, Lam today introduced a new dry photoresist technology that offers significant improvement in EUV lithography resolution, productivity and …
Patterning Symposium: Connecting Minds, Advancing Light
February 10, 2020
The full spectrum of patterning topics will be discussed at the upcoming SPIE Advanced Lithography symposium. Held at the San Jose Convention Center on February …
Smarter Future on Stage at SEMICON Korea
January 13, 2020
[Notice] SEMICON KOREA 2020 Is Canceled SEMICON Korea 2020, which was scheduled to be held from Feb 5 to Feb 7 by SEMI KOREA, will …
2019 Blog Review: Top Posts of the Year
January 6, 2020
2019 was quite a year for the Lam Blog. From sharing an inside peek at our favorite day of the year, Bring Our Children to …
Leveraging 300 mm Technologies at 200 mm for IoT and Automotive
December 16, 2019
The IoT and automotive markets use devices fabricated at a wide range of technology nodes. Taking advances made at 300 mm and applying them via …
Lam Extends Leadership in Edge Control Solutions
December 3, 2019
Addressing the critical need for higher wafer edge yield, Lam has introduced new capabilities in its Corvus® etch and Coronus® plasma bevel clean systems.
Making the Impossible Possible Through Cross-Institutional Collaboration
November 22, 2019
It is an exciting time to be in the semiconductor industry and driving technology development which is fueling the intelligent, interconnected systems that will transform …
Nanoscale Features through Atomic Scale Processing
November 18, 2019
Atomic layer etching and deposition processes offer atomic scale control through the use of self-limiting reactions. Yang Pan, corporate vice president of advanced technology development, …
SEMICON Europa Drives Smart Transportation and More
October 30, 2019
The SEMICON Europa tradeshow, the annual premier event for the global electronics industry in Europe, will take place November 12-15, 2019, at Messe München in …
Working in More-than-Moore
October 28, 2019
Moore’s Law has been the center of the semiconductor universe, dominated by a singular focus and a relentless drive to reduce transistor size and integrate …
Advanced Packaging Innovations Star at ASTC
October 24, 2019
Technology experts and business leaders will be heading to the Advanced Semiconductor Technology Conference (ASTC) 2019, organized by SEMI Southeast Asia. Held November 7-8, 2019 …
Atomic-Scale Processing and More at AVS Symposium
October 7, 2019
The science and technology of materials, interfaces, and processing will be in the spotlight at the AVS 66th International Symposium and Exhibition, being held October …
Electrochemistry Conference Preview
September 30, 2019
The fall meeting of the Electrochemical Society will be held October 13-17 in Atlanta, Georgia. A forum for the latest scientific and technical developments in …
SEDEX 2019: Semiconductor Industry Showcase
September 30, 2019
The 21st Semiconductor Exhibition (SEDEX) will be held this year at COEX in Seoul, Korea, October 8-11. The tradeshow will cover the full spectrum of …
The Future Is Smart at SEMICON Taiwan
September 9, 2019
The largest microelectronics event in Taiwan is coming to TaiNEX this fall, welcoming more than 45,000 visitors from around the world. From September 18-20, leaders …
Executive Perspective: Accelerating Innovation, Enhancing the Value of Data
September 3, 2019
At an industry and investor event held during the August 2019 Flash Memory Summit, Lam management made the case for why semiconductor innovation needs to …