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Bryan Buckalew


Bryan Buckalew is a technical director in the WETS product group at Lam Research.

Copper Electrodeposition for Fan-Out Wafer-Level Packaging

Bryan Buckalew | May 11, 2020

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As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective …