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Advances in Wafer Cleaning To Be Presented at International Conference

September 15, 2014 | Technology

The 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) will be held September 21-24 in Brussels, Belgium. This biannual conference brings together industry and academic researchers to discuss their latest results on cleaning technologies for advanced semiconductor device processing. As the industry pioneer of single-wafer spin clean technology, Lam Research is pleased to be a major sponsor of UCPSS 2014.

Wafer cleaning is a critical function that is repeated many times during the semiconductor manufacturing process, from front-end fabrication through back-end packaging. Ideally, wafer cleaning removes particles, residues, and films without damaging device features or underlying materials. This is increasingly difficult as feature dimensions shrink, structures get more fragile, and new materials are introduced. Improved understanding of chemical and physical cleaning is required to meet these challenges.

At this year’s conference, Lam will participate in two technical presentations. The first, “Wet etch rate behavior of poly-Si in TMAH solution at various ambient gas conditions,” will be presented in the “FEOL etching of IV-semiconductors” session and is co-authored with United Microelectronic Corporation (UMC). In the “Wet processing of high aspect ratio structures” session, Lam’s Dr. Mehul Patel will discuss a novel method for drying fragile structures in his presentation, “Freeze drying of high aspect ratio structures.”

For conference details please visit the UCPSS website. For information about Lam’s strip and clean solutions, please see the Products section of our website.

UCPSS 2014

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