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Advanced Packaging Innovations Star at ASTC

October 24, 2019
Clara Cheang |
Category:
Technology

Technology experts and business leaders will be heading to the Advanced Semiconductor Technology Conference (ASTC) 2019, organized by SEMI Southeast Asia. Held November 7-8, 2019 at the Marina Bay Sands Convention Centre, Singapore, this event will focus on the innovations in advanced packaging and system-level test for high-performance computing (HPC) and artificial intelligence (AI). Through our gold sponsorship we are pleased to support this conference.

On Thursday, November 7, 4:00 pm to 4:30 pm, CheePing Lee, technologist and technical marketing senior manager, will give a talk titled, “When the Package Is the Star.” His presentation will cover industry megatrends (particularly, HPC, AI, and 5G), how advanced packaging plays a key role in enabling those trends, and Lam’s packaging solutions.

We will also be at our booth in the exhibition hall throughout the conference.

Complete schedules and registration information can be found on the ASTC website. We look forward to seeing you.

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