Since first opening our doors in 1980, we have significantly expanded the markets and applications that our products and technologies serve. In this final article in our perspective series, we take a look back at how these areas have evolved over the years as chip fabrication has become increasingly complex.
Throughout our history, we have focused on delivering the technology and productivity solutions our customers need, enabling them to manufacture some of the most advanced devices for each new generation of chips. Early on, we established expertise in plasma etch, and as device manufacturing progressed, we continued to expand our applications and process areas. This involved developing new capabilities in close collaboration with customers and making key strategic acquisitions to provide timely, effective solutions. Today we offer products for plasma etch, thin film deposition, photoresist strip, and wafer cleaning. Looking ahead, these areas are expected to grow in importance as key enabling steps for industry technology inflections like multiple patterning and 3D NAND.
To learn about some of the key product and technology milestones that have brought us to where we are today, take a look at the timeline below.
In case you missed them, check out the other stories in our 35-year perspective series: end-user devices, industry milestones, and company highlights. For more about Lam’s anniversary, take a look at our Lam Turns 35 blog article.