Spotlight on Packaging and IoT at SEMICON Southeast Asia

April 25, 2016
Category:
Technology

Building on its inaugural success last year, this year’s SEMICON Southeast Asia 2016 takes place April 26-28 at the SPICE Arena in Penang, Malaysia. Lam is pleased to be a premier sponsor of this important event that showcases the microelectronics manufacturing capabilities of the region – home to a number of outsourced assembly and test (OSAT) companies and NAND flash fabs. The theme of this year’s tradeshow, “Transforming Southeast Asia Semiconductor Landscape to the New Hybrid Age,” will be explored through multiple technology and business programs, covering key topics such as packaging and the Internet of Things (IoT).

 

Advanced Packaging

High-performance applications, including mobile devices and wearables, are fueling developments in packaging processes. The region’s established strength in traditional approaches makes it a natural choice for advanced methodologies, such as chip-level and wafer-level packaging (WLP). One rapidly growing segment is fan-out WLP, which is used to manage the high ratio of pin count to chip area for mobile devices. Lam technologists will give two talks on this innovative strategy. “Electroplating Challenges and Solutions for High-Density Fan Out (HDFO) Packaging” will be given by Damo Srinivas at the Advanced Packaging Forum (Wed., April 27, 10:05 AM), and CheePing Lee will present on “Addressing Processing Challenges in High-Density Fan-Out (HDFO) Packaging” at the EXPOArena Stage (Wed., April 27, 11:30 AM).

 

Internet of Things

The abundant opportunities presented by the emergent IoT will be featured at the Technology Innovation Forum. Producing smart, connectable, and often mobile devices continues to be a growth driver for the semiconductor industry as a whole. New materials, packaging methods, and test technologies are being developed to enable increased interconnectivity. In her talk, “Enabling the IoT World: The Role of Semiconductor Manufacturing Equipment” (Wed., April 27, 10:15 AM), Lam’s Fariba Abhari will discuss the need for comprehensive technology solutions, product life cycle extension, and collaboration to support innovation in this area.

 

For more details about the show, including complete schedules and registration information, please visit the SEMICON Southeast Asia website.

 

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