SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities

April 10, 2017
Category:
Technology

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important topic of discussion. One reason is the continued consumer demand for more functionality on mobile devices like smartphones. The cool new capabilities being added need to fit into the same tiny space, and these challenging form-factor requirements are driving back-end innovation. SEMICON Southeast Asia will be an excellent opportunity to share and learn about the latest developments in this and other important areas – like the Internet of Things (IoT). More than 300 exhibitors and over 7,500 attendees from 15 countries are expected to attend the 2017 show, being held April 25-27 at the SPICE Arena in Penang, Malaysia.

New this year, the Futura X event will provide visitors with an opportunity to explore and experience the many ways that semiconductor technology is facilitating an increasingly connected world. SEMICON Southeast Asia will include several timely and relevant business forums and eight technical programs covering market trends, electronics manufacturing challenges and innovation, advanced packaging and test, and more. Lam is pleased to be a co-sponsor of the Advanced Packaging Forum, focusing on cost-effective solutions for system-in-package (SiP) and wafer-level packaging (WLP). We are also co-sponsoring the Technology Innovation Forum, which will explore opportunities for semiconductor technology to unlock the potential of the IoT. Lam experts will be on hand to present at both forums, and we will also give a talk at the EXPOArena.

Future Positioning of Advanced Packaging Technology
Choon Lee
Advanced Packaging Forum
Wednesday, April 26, 11:40 AM

Enhancing Capital Efficiency and Fab Productivity for IoT Applications
David Haynes
Technology Innovation Forum
Wednesday, April 26, 1:30 PM

Lam Research – Your Partner in Advanced Packaging
Chee Ping Lee
EXPOArena
Tuesday, April 25, 4 PM

In addition, Lam will be hosting a private Seminar Day on Tuesday, April 25, at the Spice Arena. Presenters will share their views on topics ranging from advanced packaging technologies and trends, the re-emergence of 200 mm manufacturing, product lifetime extension for the IoT, and more.

Complete schedules and registration information can be found on the SEMICON Southeast Asia website.

 

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