PRiME 2016 Conference Preview

September 26, 2016

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research conferences in the world, this conference is the joint effort of The Electrochemical Society (ECS), The Electrochemical Society of Japan (ECSJ), and The Korean Electrochemical Society (KECS). The meeting’s interdisciplinary nature makes it the ideal place for researchers to share recent results in areas such as electrochemical deposition, electronic materials and processing, and nanotechnology.

Lam is pleased to be a Gold Sponsor of two technical symposia: Atomic Layer Deposition Applications (G03) and Processing Materials of 3D Interconnects, Damascene and Electronics Packaging (G04). We will also have six technical presentations, including an invited talk, covering metallization, atomic layer deposition (ALD), electroless deposition, and advanced wafer cleaning:


Electroless Deposition Using Metal Ion Based Reducing Agents: Potential Benefits and Applications in Semiconductor Manufacturing
A. Joi, Y. Dordi (Lam Research)
Monday, October 3, 2016, 2:30 PM

Electroless Deposition of High Quality Co Films on Cu Polycrystalline Substrate Assisted By Pb UPD Monolayer
D. Wu (University of Houston); A. Joi (Case Western Reserve University); Y. Dordi (Lam Research); S. Brankovic (University of Houston)
Tuesday, October 4, 2016, 10:00 AM

(Invited) Interconnect Metals for Future Integrated Circuits
P. Besser, H. J. Wu, Y. Jiang, K. Chattopadhyay, L. Brogan, L. Zhao, N. Doubina, P. Nalla, A. Kolics (Lam Research)
Tuesday, October 4, 2016, 3:40 PM

Electrodeposition of CuMn from a Deep Eutectic Electrolyte
P. W. Wu, W. S. Chiang, C. Y. Hsu, T. W. Chung (National Chiao Tung University); P. C. Chen (National Taipei University of Technology); Y. Dordi, A. Joi (Lam Research)
Tuesday, October 4, 2016, 6:00 PM

Particle Removal in Wet Wafer Cleaning Processes
J. Zhu, M. Xia, D. Mui, M. Kawaguchi (Lam Research)
Wednesday, October 5, 2016, 10:20 AM

Electrochemical Atomic Layer Deposition of Copper Mediated By Underpotentially Deposited Zinc
K. Venkatraman, R. Gusley, L. Yu (Case Western Reserve University); Y. Dordi (Lam Research); R. Akolkar (Case Western Reserve University)
Wednesday, October 5, 2016, 4:00 PM


Complete schedules and registration information can be found on the PRiME 2016 website. We look forward to seeing you at the conference.



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