Lam Blog

Tech Brief: A Look at Atomic Layer Deposition (ALD)

May 15, 2017

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Industry, Technology

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …

SEMICON Southeast Asia to Highlight Back-End and IoT Opportunities

April 10, 2017

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Technology

Southeast Asia is a major hub for the chip industry’s assembly, packaging, and test services – back-end manufacturing processes that are becoming an increasingly important …

Technology and Economic Considerations for Panel-Level Fan-Out Packaging

April 3, 2017

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Industry, Technology

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …

Gearing Up for SEMICON China 2017

March 6, 2017

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Technology

In recent years, SEMICON China has become the semiconductor industry’s largest annual tradeshow, with much of its popularity likely due to the region’s growing chipmaking …

Focus on Next-Gen Chipmaking at SPIE Advanced Lithography Symposium

February 21, 2017

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Technology

It really is remarkable how our favorite tech products continue to become more compact and powerful, with today’s nanoscale chipmaking quite literally pushing the limits …

SEMICON Korea to Explore Latest Technology Advances

February 6, 2017

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Technology

For its 30th anniversary, SEMICON Korea anticipates hosting its largest show ever, with an estimated 40,000 attendees converging at COEX in Seoul on February 8-10, …

Tech Brief: Primer on Packaging

January 17, 2017

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Industry, Technology

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. …

Flashback to 2016

January 3, 2017

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Industry, Technology

Happy New Year and welcome back to the Lam Blog! For our first article of 2017, we wanted to share a few of our most …

SEMICON Japan to Showcase Manufacturing Innovations

December 12, 2016

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Technology

This year marks the 40th anniversary for SEMICON Japan, one of the most extensive international exhibitions of semiconductor equipment and materials. Each SEMI tradeshow has …

Continued Scaling with Multiple Patterning

November 28, 2016

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Industry, Technology

Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other …

Tech Brief: All About ALE

November 14, 2016

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Industry, Technology

Greek philosopher Democritus (460-370 BC) first proposed the existence of an ultimate particle, which he described as “atomos.” He probably never dreamed that one day …

AVS Symposium – Plasma Research and Thin Film Science

November 7, 2016

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Technology

State-of-the-art advances in plasma research and thin film science will be discussed at the AVS 63rd International Symposium and Exhibition, being held November 6-11 in …

PRiME 2016 Conference Preview

September 26, 2016

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Technology

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research …

Tech Brief: FinFET Fundamentals

September 12, 2016

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Industry, Technology

Transistors are at the heart of our cherished electronics. Millions, or even billions, of these tiny switches go to work for us when we check …

New Atomic Layer Etching Capability Enables Continued Device Scaling

September 6, 2016

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Corporate, Technology

With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric …

SEMICON Taiwan to Focus on Industry Future

August 29, 2016

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Technology

The semiconductor manufacturing community is gearing up for SEMICON Taiwan, the largest microelectronics event in Taiwan, which is expected to attract more than 40,000 visitors …

Innovative Tungsten ALD Process Provides Pathway to New Memory Chip Production

August 9, 2016

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Corporate, Technology

Addressing critical needs for next-generation 3D NAND and DRAM devices, Lam has developed the industry’s first all-atomic layer deposition (ALD) low-fluorine tungsten (LFW) fill process …

Multipatterning Poses Process Challenges

August 1, 2016

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Industry, Technology

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of …

ALD Conference and ALE Workshop Explore Nanoscale Processing

July 25, 2016

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Technology

Chip designs are changing. Features are shrinking to incredibly small dimensions and radically new device architectures are being devised to supply consumers with smaller, more …

Evolution of Uniformity Control: Looking Back and Peeking Ahead

July 18, 2016

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Technology

The semiconductor industry has long relied on the development of innovative device architectures and technologies to continue device scaling. Making these a reality in production, …

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