Lam Blog

Semiconductors in Wired Communications

July 24, 2017

Share This:


Industry

Wired communications can be traced back to 1844, when Samuel Morse (creator of the code of dots and dashes that bears his name) sent the first telegraph message from the U.S. Supreme Court chambers in Washington, D.C. to the Mount Clair railway depot in Baltimore, Maryland. Fourteen years later, the first transatlantic telegraph cable was completed. Alexander Graham Bell’s famous first telephone call transformed communication again, moving from dots and dashes over the wires to voice. The first telephone line was set up in 1877 in Boston, Massachusetts, but it wasn’t until 1956 that the first transatlantic telephone cable was launched. As wired communications have continued to advance, semiconductors are playing an important role in enabling the new technologies that keep us connected.

Tech for Pets

June 26, 2017

Share This:


Industry

We use technology to improve nearly every area of life, and doting on our pets’ well-being is no exception. In fact, many pet stores now …

Silicon Snack – Stepping Out with Smart Shoes

June 19, 2017

Share This:


Industry

In Ancient Egypt, shoes denoted social status, even distinguishing commoners and nobility by the color and length of their footwear. Recreated ruby slippers commemorating the …

Smart Cities – How the IoT Is Changing Urban Life in Asia

June 5, 2017

Share This:


Industry

From smart grids to smart buildings, the Internet of Things (IoT) has swept across Asia. Going well beyond consumer wearables, today’s city planners are leveraging …

Semiconductors in Wireless Communications

May 30, 2017

Share This:


Industry

“Mr. Watson, come here. I want to see you,” are the familiar words of Alexander Graham Bell to his assistant during the world’s very first …

Tech Brief: A Look at Atomic Layer Deposition (ALD)

May 15, 2017

Share This:


Industry, Technology

Imagine being able to deposit a film of material just a few atomic layers at a time. As impossible as that sounds, atomic layer deposition …

Silicon Snack: Food Preparation – Taste the Future

May 1, 2017

Share This:


Industry

Household kitchens have been revolutionized by chips (we’re talking the non-edible kind). Some of us may bask in fond memories of “low-tech” cooking like toasting …

Lam’s CEO Talks Tech Trends on CNBC

April 25, 2017

Share This:


Corporate, Industry

Lam President and CEO Martin Anstice spoke with Squawk Alley about the semiconductor roadmap, silicon device demand, and Lam’s role in tech innovation. Here we …

Earth Day 2017 – Energy Efficiency Enabled by Technology

April 17, 2017

Share This:


Industry

This year, more than a billion people from over 193 countries are expected to participate in Earth Day activities. Marking its 47th anniversary on Saturday, …

Technology and Economic Considerations for Panel-Level Fan-Out Packaging

April 3, 2017

Share This:


Industry, Technology

Panel-level fan-out chip manufacturing – using large square or rectangular substrates instead of wafers – is being developed as a means to lower the cost …

Wearables Without Screens – Enhancing Quality of Life

March 20, 2017

Share This:


Industry

User experience designers around the world recognize that a screen isn’t always the most logical interface for every task or every person. Currently, much of …

Tech Brief: Primer on Packaging

January 17, 2017

Share This:


Industry, Technology

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. …

Taking Smart Fashion Mainstream

January 9, 2017

Share This:


Industry

The next major trend in consumer wearables may be smart fashion. For years, high fashion designers and celebrities have been incorporating smart technology into their …

Flashback to 2016

January 3, 2017

Share This:


Industry, Technology

Happy New Year and welcome back to the Lam Blog! For our first article of 2017, we wanted to share a few of our most …

Continued Scaling with Multiple Patterning

November 28, 2016

Share This:


Industry, Technology

Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other …

Tech Brief: All About ALE

November 14, 2016

Share This:


Industry, Technology

Greek philosopher Democritus (460-370 BC) first proposed the existence of an ultimate particle, which he described as “atomos.” He probably never dreamed that one day …

Spooky Science – Tech or Treat!

October 31, 2016

Share This:


Industry

The lines between science fiction and reality continue to blur thanks to technological advances in devices like thermal imaging equipment, 3D printing, and even neural …

How Semiconductors Are Changing Our Homes

October 3, 2016

Share This:


Industry

From smartphones to televisions to refrigerators, it is hard to go more than a few hours without using a semiconductor-enabled device. In fact, since the …

Tech Brief: FinFET Fundamentals

September 12, 2016

Share This:


Industry, Technology

Transistors are at the heart of our cherished electronics. Millions, or even billions, of these tiny switches go to work for us when we check …

Multipatterning Poses Process Challenges

August 1, 2016

Share This:


Industry, Technology

Multiple patterning is an innovative approach to scaling semiconductors, but it also poses significant challenges controlling process variations. Lam’s Rick Gottscho, executive vice president of …

Page 1 of 3123