Tech Brief: Primer on Packaging

January 17, 2017 , Industry, Technology
Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure protects the fragile integrated circuits inside, as well as dissipates heat, keeps chips isolated from each other, and, importantly, provides connection to the circuit board and other elements. The manufacturing steps involved in creating these protective structures and connections are collectively known as “packaging.” This activity has seen revolutionary changes in recent years, propelled by the drive for smaller and more powerful chips.

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Industry, Technology

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Wishing You a Happy Holiday Season

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Corporate

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Continued Scaling with Multiple Patterning

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Industry, Technology

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November 21, 2016

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Life at Lam

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Tech Brief: All About ALE

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Technology

Greek philosopher Democritus (460-370 BC) first proposed the existence of an ultimate particle, which he described as “atomos.” He probably never dreamed that one day …

AVS Symposium – Plasma Research and Thin Film Science

November 7, 2016

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Technology

State-of-the-art advances in plasma research and thin film science will be discussed at the AVS 63rd International Symposium and Exhibition, being held November 6-11 in …

Spooky Science – Tech or Treat!

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Industry

The lines between science fiction and reality continue to blur thanks to technological advances in devices like thermal imaging equipment, 3D printing, and even neural …

Spotlight on Lam Research India

October 17, 2016

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Corporate, Life at Lam

Recognized globally as a major IT hub, India is an important technology contributor and our Bangalore office is more than keeping pace. Since first established …

Celebrating National Manufacturing Day

October 10, 2016

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Community, Life at Lam

Lam is proud to be one of nearly 2,500 companies across the United States celebrating modern manufacturing and inspiring the next generation of workers. Each …

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October 3, 2016

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Industry

From smartphones to televisions to refrigerators, it is hard to go more than a few hours without using a semiconductor-enabled device. In fact, since the …

PRiME 2016 Conference Preview

September 26, 2016

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Technology

Electrochemistry and solid-state science and technology will come together at the PRiME 2016 Meeting, held October 2-7 in Honolulu, Hawaii. One of the largest research …

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September 19, 2016

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Community, Corporate

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Tech Brief: FinFET Fundamentals

September 12, 2016

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Industry, Technology

Transistors are at the heart of our cherished electronics. Millions, or even billions, of these tiny switches go to work for us when we check …

New Atomic Layer Etching Capability Enables Continued Device Scaling

September 6, 2016

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Corporate, Technology

With the introduction of Lam’s latest Flex™ dielectric etch system, we have expanded our atomic layer etching (ALE) portfolio to include both conductor and dielectric …

SEMICON Taiwan to Focus on Industry Future

August 29, 2016

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Technology

The semiconductor manufacturing community is gearing up for SEMICON Taiwan, the largest microelectronics event in Taiwan, which is expected to attract more than 40,000 visitors …

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